Posts Tagged ‘TI’
Thursday, December 28th, 2017
When Sales Force entertains, they really entertain. And so it was in the first week of November in San Francisco when 175,000 people came to town to be part of the company’s DreamForce confab.
I made the mistake of being on the Streets of San Francisco on Tuesday, November 7th, and was witness to the madding DreamForce crowds – particularly the lucky 50,000+ of them headed to AT&T Park where Alicia Keyes and Lenny Kravitz were waiting to entertain the VIPs of the SalesForce world.
Although the traffic was debilitating on that Tuesday night, the sheer scale of the SalesForce presence (now very obvious in San Francisco as their towering mega-temple is about debut) provided such an interesting compare and contrast to my adventures on the following morning.
On Wednesday, November 8th, I had the good fortune to attend a Press and Analyst briefing at a low-slung building in Silicon Valley.
The hosts of that event were the leadership and evangelists of a small, laser-focused group called Silicon Catalyst – an incubator that intends to pave the way for the semiconductor super stars of the future. The folks at Silicon Catalyst hope that one of the companies in their carefully vetted portfolio may become the SalesForce of tomorrow, the mega-force in technology that dominates cities, skylines, and baseball parks.
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Tags: ACP Semiconductor, Active Layer Parametrics, AEPONYX, Alex Wright-Gladstein, Ayar Labs, Chaos Prime, ClopTech, GMK, Mamoon Rashid, Nick Kepler, On Semiconductor, One Silicon Chip Photonics, Power Down Semiconductor, ProbiusDX, Raul Camposano, REX Computing, Rich Goldman, Rick Lazansky, SalesForce, Silicon Catalyst, Spark Microsystems, TI, Xceler Systems, Zeno Semiconductor
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Thursday, July 21st, 2016
Who better qualified to post reactions to this week’s astonishing news out of Tokyo and Cambridge – SoftBank is buying ARM in an all-cash deal for 24.3 billion British pounds – than the leaders of two highly regarded IP companies and an articulate Brit with total street cred in EDA.
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Tags: ARM. SoftBank, Brexit, CAST IP, Dave Kelf, Hal Barbour, Intel, IoT, IPextreme, NXP/Freescale, OneSpin, RISC-V project, TI, Warren Savage
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Wednesday, January 27th, 2016
The book that Sir Robin Saxby has been waiting for has finally been written: “Mobile Unleashed: The Origin and Evolution of ARM Processors in Our Devices”.
Authored by SemiWiki’s Dan Nenni and Don Dingee, the book “delivers an informative look at events and technology that powered the mobile device industry to worldwide adoption.”
When I spoke with Dingee by phone this week, he said the book represents an enormous amount of work: “Sixteen months of intense research, 270 pages and over 800 footnotes.”
Other books have been written about ARM, he acknowledged, but this one is different: “People ask if this is a technology book or the story of ARM and I say, in truth it’s a little bit of both.”
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Tags: ARM, Dan Nenni, Don Dingee, Google, Huawei, Intel, MediaTek, Mentor Graphics, Microsoft, MIPS, Motorola, Nokia, Qualcomm, Sir Robin Saxby, TI, Wally Rhines
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Thursday, October 2nd, 2014
This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.
By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”
Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.
** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”
** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and mbed.org, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.
** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”
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Tags: Acacia Communications, Airbus Defence and Space, Aldec, Altium Ltd., AMD, ANSYS, AppliedMicro, ARicent, ARM, ARM TechCon 2014, Arteris, ASSET InterTech, Atmel, Avago Technologies, Aviva Energy Corp., Cadence, Carbon Design Systems, Cavium, Cisco, Codasip, Doulos, Esterel, Express Logic, FreeBSD Foundation, Freescale, Gartner, GlobalFoundries, Green Hills Software, HP, IAR Systems, Intel, Internet of Things, IPSO Alliance, Lauterbach, LogMeIn, Mentor Graphics, Micrium, MontaVista Software, Mouser Electronics, Open-Silicon, P&E Microcomputer Systems, Rambus, Real Intent, Renesas Electronics, S2C, Samsung Electronics, SatixFy Ltd., SeeControl, SEGGER, Si2, SOMNIUM Technologies, Sonics, Spansion, STMicro, SYSGO, Teledyne LeCroy, TI, Toradex, TSMC, Undo Software, Uniquify, VanGogh Imaging, Vector Software, Wind River, Xilinx, XMOS, Zebra Technologies, Zuse Institute Berlin
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Thursday, February 27th, 2014
It makes it worthwhile to show up for work on days when you get to have a conversation with people like the folks of Sonics, a System IP vendor based in Silicon Valley. Articulate and knowledgeable, they have a nuanced understanding of how the IP business works, its challenges and opportunities.
When I spoke to them last week about my ongoing project to assemble IP for the chip in my Dick Tracy keychain, President & CEO Grant Pierce and VP of Operations Raymond Brinks were both on the call. We started by talking about how IP is priced.
Per Pierce: “The conditions under which various customers buy and use IP can be quite different. We have some customers who are fairly sophisticated. We sell [such customers] licensed IP, offer some initial training, and then off they go. After that, apart from an occasional email, we have little contact with them. There are customers, however, who are opposite in the extreme.
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Tags: AMBA, ARM, Cadence, Drew Wingard, Grant Pierce, IP, Nokia, OCP-IP, PIF, Raymond Brinks, Sonics, Tensilica, TI
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Thursday, April 4th, 2013
Despite grumbling to the contrary, even some that I myself put forth in a blog earlier this year, there will indeed be a daily dose of IP information doled out at DAC in Austin in June. If you’re interested in IP, DAC 2013 actually promises to be quite informative. You can arrange your schedule so as to attend a single significant session each day devoted to various aspects of IP with all of its promise and particulars.
Here’s your DAC planning guide …
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Tags: Arteris, Atrenta, Chris Rowen, DAC 2013, Dan Kochpatcharin, David Murray, Duolog Technologies, Frank Ferro, Freescale, Hans Bouwmeester, IPextreme, John Eaton, John Swanson, Jose Nunez, Kamlesh Kumar Pathak, Keith Odom, Laurent Moll, Magillem Design Services, McKenzie Mortensen, Michael Cizi, Mike Gianfagna, Nagendra Gulur, National Instruments, Open-Silicon, Ouabache Designworks, Sonics, Southwest Reuse, STMicro, Sylvain Duvilliard, Tensilica, TI, TSMC, Vasant Kumar Easwaran, Warren Savage
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Thursday, February 14th, 2013
After the euphoniously monikered IP provider, Uniquify, announced several weeks ago that the more whimsically monikered organization, Pixelworks, is using Uniquify’s DDR memory controller subsystem IP for multiple distinct processors that Pixelworks is, in turn, providing to TV makers who make 4Kx2K ultra high-def systems, one question still remained: How did Pixelworks know to use Uniquify’s offering?
According to a January 2013 article in IEEE Spectrum, knowing what IP to use in a project here in the 21st century is fairly easy knowledge to come by. I don’t know what planet the author of the op-ed piece, “Other People’s Knowledge”, lives on but it doesn’t seem to be the one that I hear about from the folks who make or buy third-party IP.
In fact, those people seem to indicate that knowing what IP to use in a particular project continues to be far more art than science. In particular, because until a system, or sub-system, is fully defined, modeled and simulated – let alone, manufactured and deployed in the field – one can never really know how a piece of IP is going to work in the environment into which it’s been placed.
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Tags: BarcoSilix, Cadence, DDR memory controller IP, Eureka Technology, IP, TI, Uniquify, Xilinx
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Thursday, November 1st, 2012
You didn’t have to crank up Queen to hear the refrain in the background when ARM CEO Warren East stepped on stage in Silicon Valley this morning to deliver his keynote at the 2012 edition of ARM TechCon. No matter how you slice the pie, ARM is the champion of the world. They know it, they know that you and I know it, and we know that they know that we know it.
Yet despite all that knowing, the guys from ARM seem like a pretty likable bunch. A month ago, I heard ARM CTO Mike Muller give the keynote at the Sophia Antipolis Microelectronics Forum, where he left the same impression with his audience on the Cote d’Azure that Warren East left with his audience this morning in the heart of Silicon Valley: ARM puts cooperation above competition, partnering above posturing, and the well-being of the world above the well-being of the bottom line of ARM or the pocketbook any of its employees.
ARM may be the champion of the world, but it’s for a reason. They’re very good at what they do, they’ve had the luck and foresight to be in the right place at the right time over the last 2 decades, and they are as concerned as the rest of us about the plethora [read “billions”] of digital devices descending on the world which threaten to drive us all to the brink of destruction by way of global warming, polluted environs, or both.
Okay, that’s my qualitative take on this morning’s keynote. Following is a more quantitative version.
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Tags: A50 processor series, ARM, ARM TechCon, Freescale, George Gray, IBM, Internet of Things, Judson Althoff, Linaro, Linus Torvalds, Mike Muller, Oracle, Queen, Samsung, ST-Ericsson, TI, Warren East
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Thursday, October 18th, 2012
The MIPI Alliance was founded in 2003 by STMicro, ARM, Nokia and TI. In 2004, Intel, Motorola, Samsung and Philips joined. Today, there are over 240 companies in the Alliance, 18 working groups, and over 5000 participating individuals. Following his presentation during the general session at SAME Forum in Sophia Antipolis, I had a chance to speak with STMicro’s Joel Huloux, Chairman of the Board of Directors of the MIPI Alliance.
Huloux differentiated between the work of the MIPI Alliance and OCP-IP: “OCP-IP is more related to the inside of the chip. It is very useful for interconnect when you buy IP to put in your design. If you look at MIPI Alliance, however, we do not deal with internal bus processors, or networks. We deal with the interface which is external to the chip, particularly in a mobile device, the interface between the chip and the display, camera, and so on. There is no competition at all between OCP-IP and MIPI Alliance.”
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Tags: Apple, ARM, Google, Intel, Joel Huloux, Microsoft, MIPI Alliance, Motorola, Nokia, OCP-IP, Philips, SAME Forum, Samsung, STMicro, TI
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