Posts Tagged ‘STMicro’
Thursday, April 7th, 2016
Synopsys Marketing Director and long-time EDA contributor Dave Reed talked recently about the company’s new, highly anticipated product release, Custom Compiler.
“This tool is definitely needed by designers,” Dave said, “and is motivated by the increasing use of FinFET devices. Here at Synopsys we have 1300 engineers in our IP team, with lots of these people turning to FinFETs in their design.”
Not an easy transition, he noted: “A single transistor exists in a planer mode, but it becomes a much more complex device in a FinFET. The layout becomes more complex, and so does the approach to design.”
There have been some developments with respect to custom design, Dave acknowledged: “Most recently, you could actually automate your layout with constraints. However, typing in those constraints is so time-consuming.
“With Custom Compiler, we have moved instead to a visually constrained layout, which allows you to re-apply what you’ve already done – both to your current work and to your future work as well.
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Tags: Antun Domic, Asahi Kasei Microdevices, Ciranova, Custom Compiler, Dave Reed, finFET, GSI Technology, Magma, Springsoft, STMicro, Synopsys
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Wednesday, August 19th, 2015
When it comes to Docea Power, there’s no scoop. There’s no news at all. Except of course that they’ve been bought by Intel, which in itself is pretty big news for any company. Except apparently Docea. There was/is no press release and was/is no access to details on the deal. Nothing.
There is proof, however, that the acquisition took place. Right on the front of the Docea website. But that’s it.
Having interviewed the brothers who founded Docea, Ghislain and Sylvain Kaiser, multiple times over the years – at DATE in Europe and at various conferences here in the U.S. — I certainly hoped to know more, and I tried. But their people — the ones who reached out to journalists in June asking for meetings with the company at DAC, back when Docea still existed — were candid: “There is no press release available. And there will be no talk with Docea founders”
And that’s it. Except for this …
Lucky Intel!
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Tags: ACEplorer 2.0, AceThermalModeler, ANSYS, DOCEA Power, Ghislain Kaiser, Infineon, Intel, Mentor, ST-Ericsson, STMicro, Sylvain Kaiser
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Thursday, October 2nd, 2014
This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.
By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”
Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.
** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”
** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and mbed.org, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.
** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”
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Tags: Acacia Communications, Airbus Defence and Space, Aldec, Altium Ltd., AMD, ANSYS, AppliedMicro, ARicent, ARM, ARM TechCon 2014, Arteris, ASSET InterTech, Atmel, Avago Technologies, Aviva Energy Corp., Cadence, Carbon Design Systems, Cavium, Cisco, Codasip, Doulos, Esterel, Express Logic, FreeBSD Foundation, Freescale, Gartner, GlobalFoundries, Green Hills Software, HP, IAR Systems, Intel, Internet of Things, IPSO Alliance, Lauterbach, LogMeIn, Mentor Graphics, Micrium, MontaVista Software, Mouser Electronics, Open-Silicon, P&E Microcomputer Systems, Rambus, Real Intent, Renesas Electronics, S2C, Samsung Electronics, SatixFy Ltd., SeeControl, SEGGER, Si2, SOMNIUM Technologies, Sonics, Spansion, STMicro, Synopsys, SYSGO, Teledyne LeCroy, TI, Toradex, TSMC, Undo Software, Uniquify, VanGogh Imaging, Vector Software, Wind River, Xilinx, XMOS, Zebra Technologies, Zuse Institute Berlin
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Thursday, April 4th, 2013
Despite grumbling to the contrary, even some that I myself put forth in a blog earlier this year, there will indeed be a daily dose of IP information doled out at DAC in Austin in June. If you’re interested in IP, DAC 2013 actually promises to be quite informative. You can arrange your schedule so as to attend a single significant session each day devoted to various aspects of IP with all of its promise and particulars.
Here’s your DAC planning guide …
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Tags: Arteris, Atrenta, Chris Rowen, DAC 2013, Dan Kochpatcharin, David Murray, Duolog Technologies, Frank Ferro, Freescale, Hans Bouwmeester, IPextreme, John Eaton, John Swanson, Jose Nunez, Kamlesh Kumar Pathak, Keith Odom, Laurent Moll, Magillem Design Services, McKenzie Mortensen, Michael Cizi, Mike Gianfagna, Nagendra Gulur, National Instruments, Open-Silicon, Ouabache Designworks, Sonics, Southwest Reuse, STMicro, Sylvain Duvilliard, Synopsys, Tensilica, TI, TSMC, Vasant Kumar Easwaran, Warren Savage
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Thursday, October 18th, 2012
The MIPI Alliance was founded in 2003 by STMicro, ARM, Nokia and TI. In 2004, Intel, Motorola, Samsung and Philips joined. Today, there are over 240 companies in the Alliance, 18 working groups, and over 5000 participating individuals. Following his presentation during the general session at SAME Forum in Sophia Antipolis, I had a chance to speak with STMicro’s Joel Huloux, Chairman of the Board of Directors of the MIPI Alliance.
Huloux differentiated between the work of the MIPI Alliance and OCP-IP: “OCP-IP is more related to the inside of the chip. It is very useful for interconnect when you buy IP to put in your design. If you look at MIPI Alliance, however, we do not deal with internal bus processors, or networks. We deal with the interface which is external to the chip, particularly in a mobile device, the interface between the chip and the display, camera, and so on. There is no competition at all between OCP-IP and MIPI Alliance.”
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Tags: Apple, ARM, Google, Intel, Joel Huloux, Microsoft, MIPI Alliance, Motorola, Nokia, OCP-IP, Philips, SAME Forum, Samsung, STMicro, TI
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