Posts Tagged ‘Open-Silicon’
Thursday, December 7th, 2017
This week on Thursday, December 14th, the second annual edition of REUSE 2017 will unfold in Silicon Valley. It’s a gathering crafted specifically for the vendors of IP blocks, and now whole sub-systems, those pieces of the puzzle which allow the vendors’ customers to design and produce electronic products more efficiently and with better results.
It goes without saying that IP is a pivotal part of the semiconductor supply chain today. Organizations like Arm and Synopsys reap huge benefits from being among the principal suppliers of that IP. But there are hundreds of IP companies in the world – big, medium, and small – that also provide IP.
Potentially, they could all be participating in something like Reuse 2017. Arm, for instance, is participating in the conference, along with dozens of smaller companies. Synopsys, however, is not.
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Tags: Achronix, Aldec, Andes Technology, Aphion, Archband, ARM, Avery Design Systems, CAST, Certus Semiconductor, ChipEstimate.com, City Semiconductor, Corigine, DAC, eFabless, FlexLogix, Intel, Intrinsic ID, IP-SoC, Menta, Mixel, Mobile Semiconductor, Mobiveil, Moortec, NSCore, NVM Engines, OmniDesign, Open-Silicon, QuickLogic, Reuse 2017, RISC-V, Samsung, Semi IP Systems, SiFive, Silicon Creations, Silvaco, Sintegra, SmartFlow, Sofics, Sonics, Surecore, Synopsys, True Circuits, Uniquify No Comments »
Thursday, October 2nd, 2014
This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.
By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”
Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.
** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”
** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and mbed.org, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.
** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”
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Tags: Acacia Communications, Airbus Defence and Space, Aldec, Altium Ltd., AMD, ANSYS, AppliedMicro, ARicent, ARM, ARM TechCon 2014, Arteris, ASSET InterTech, Atmel, Avago Technologies, Aviva Energy Corp., Cadence, Carbon Design Systems, Cavium, Cisco, Codasip, Doulos, Esterel, Express Logic, FreeBSD Foundation, Freescale, Gartner, GlobalFoundries, Green Hills Software, HP, IAR Systems, Intel, Internet of Things, IPSO Alliance, Lauterbach, LogMeIn, Mentor Graphics, Micrium, MontaVista Software, Mouser Electronics, Open-Silicon, P&E Microcomputer Systems, Rambus, Real Intent, Renesas Electronics, S2C, Samsung Electronics, SatixFy Ltd., SeeControl, SEGGER, Si2, SOMNIUM Technologies, Sonics, Spansion, STMicro, Synopsys, SYSGO, Teledyne LeCroy, TI, Toradex, TSMC, Undo Software, Uniquify, VanGogh Imaging, Vector Software, Wind River, Xilinx, XMOS, Zebra Technologies, Zuse Institute Berlin No Comments »
Thursday, April 4th, 2013
Despite grumbling to the contrary, even some that I myself put forth in a blog earlier this year, there will indeed be a daily dose of IP information doled out at DAC in Austin in June. If you’re interested in IP, DAC 2013 actually promises to be quite informative. You can arrange your schedule so as to attend a single significant session each day devoted to various aspects of IP with all of its promise and particulars.
Here’s your DAC planning guide …
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Tags: Arteris, Atrenta, Chris Rowen, DAC 2013, Dan Kochpatcharin, David Murray, Duolog Technologies, Frank Ferro, Freescale, Hans Bouwmeester, IPextreme, John Eaton, John Swanson, Jose Nunez, Kamlesh Kumar Pathak, Keith Odom, Laurent Moll, Magillem Design Services, McKenzie Mortensen, Michael Cizi, Mike Gianfagna, Nagendra Gulur, National Instruments, Open-Silicon, Ouabache Designworks, Sonics, Southwest Reuse, STMicro, Sylvain Duvilliard, Synopsys, Tensilica, TI, TSMC, Vasant Kumar Easwaran, Warren Savage No Comments »
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