Posts Tagged ‘Freescale’
Thursday, October 2nd, 2014
This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.
By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”
Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.
** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”
** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and mbed.org, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.
** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”
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Tags: Acacia Communications, Airbus Defence and Space, Aldec, Altium Ltd., AMD, ANSYS, AppliedMicro, ARicent, ARM, ARM TechCon 2014, Arteris, ASSET InterTech, Atmel, Avago Technologies, Aviva Energy Corp., Cadence, Carbon Design Systems, Cavium, Cisco, Codasip, Doulos, Esterel, Express Logic, FreeBSD Foundation, Freescale, Gartner, GlobalFoundries, Green Hills Software, HP, IAR Systems, Intel, Internet of Things, IPSO Alliance, Lauterbach, LogMeIn, Mentor Graphics, Micrium, MontaVista Software, Mouser Electronics, Open-Silicon, P&E Microcomputer Systems, Rambus, Real Intent, Renesas Electronics, S2C, Samsung Electronics, SatixFy Ltd., SeeControl, SEGGER, Si2, SOMNIUM Technologies, Sonics, Spansion, STMicro, Synopsys, SYSGO, Teledyne LeCroy, TI, Toradex, TSMC, Undo Software, Uniquify, VanGogh Imaging, Vector Software, Wind River, Xilinx, XMOS, Zebra Technologies, Zuse Institute Berlin
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Wednesday, June 12th, 2013
Freescale IP Design Manager Jose Nunez presented a tutorial on Tuesday, June 4th, at the Design Automation Conference in Austin entitled “Challenges of Integrating External IP”. Through a show of hands, he found the majority of his audience were IP users and therefore knew his comments would be of more than passing interest.
Nunez first noted there are even challenges in reusing internally-generated IP – big companies often have multiple groups, each with different ways and methodologies for designing IP blocks. He said, however, his talk would focus on licensing third-party IP – standard IP such as PCI Express and USB, which would add no value to Freescale if developed internally, as well as other types of IP, which if developed internally might exceed a need-by date. In such cases, he said, licensing third-party IP almost always proves cheaper in the long run, but it has to be done with care!
Nunez cited common misconceptions: 1) When companies use widely-available third-party IP from known providers, it means those blocks come with fewer bugs. 2) If everybody’s using third-party IP, it can’t be that hard to integrate it into a project. 3) Third-party IP always delivers best-in-class features, maturity, power and speed. Having set the stage, he then listed some straightforward guidelines for interfacing with IP vendors, and using their products.
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Tags: Freescale, Integrating external IP, Jose Nunez, third-party IP
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Thursday, April 4th, 2013
Despite grumbling to the contrary, even some that I myself put forth in a blog earlier this year, there will indeed be a daily dose of IP information doled out at DAC in Austin in June. If you’re interested in IP, DAC 2013 actually promises to be quite informative. You can arrange your schedule so as to attend a single significant session each day devoted to various aspects of IP with all of its promise and particulars.
Here’s your DAC planning guide …
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Tags: Arteris, Atrenta, Chris Rowen, DAC 2013, Dan Kochpatcharin, David Murray, Duolog Technologies, Frank Ferro, Freescale, Hans Bouwmeester, IPextreme, John Eaton, John Swanson, Jose Nunez, Kamlesh Kumar Pathak, Keith Odom, Laurent Moll, Magillem Design Services, McKenzie Mortensen, Michael Cizi, Mike Gianfagna, Nagendra Gulur, National Instruments, Open-Silicon, Ouabache Designworks, Sonics, Southwest Reuse, STMicro, Sylvain Duvilliard, Synopsys, Tensilica, TI, TSMC, Vasant Kumar Easwaran, Warren Savage
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Thursday, November 1st, 2012
You didn’t have to crank up Queen to hear the refrain in the background when ARM CEO Warren East stepped on stage in Silicon Valley this morning to deliver his keynote at the 2012 edition of ARM TechCon. No matter how you slice the pie, ARM is the champion of the world. They know it, they know that you and I know it, and we know that they know that we know it.
Yet despite all that knowing, the guys from ARM seem like a pretty likable bunch. A month ago, I heard ARM CTO Mike Muller give the keynote at the Sophia Antipolis Microelectronics Forum, where he left the same impression with his audience on the Cote d’Azure that Warren East left with his audience this morning in the heart of Silicon Valley: ARM puts cooperation above competition, partnering above posturing, and the well-being of the world above the well-being of the bottom line of ARM or the pocketbook any of its employees.
ARM may be the champion of the world, but it’s for a reason. They’re very good at what they do, they’ve had the luck and foresight to be in the right place at the right time over the last 2 decades, and they are as concerned as the rest of us about the plethora [read “billions”] of digital devices descending on the world which threaten to drive us all to the brink of destruction by way of global warming, polluted environs, or both.
Okay, that’s my qualitative take on this morning’s keynote. Following is a more quantitative version.
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Tags: A50 processor series, ARM, ARM TechCon, Freescale, George Gray, IBM, Internet of Things, Judson Althoff, Linaro, Linus Torvalds, Mike Muller, Oracle, Queen, Samsung, ST-Ericsson, TI, Warren East
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Thursday, August 23rd, 2012
Behind Warren Savage’s calm and courteous demeanor beats the heart of a revolutionary: A guy who not only talks the talk, but walks the walk of growing his beloved IP industry through the most radical of ideas – cooperation.
 Warren is the founder and CEO of IPextreme, a Silicon-Valley based company helping other companies commercialize their IP, small nuggets of pure gold that would otherwise enjoy only internal use. With the assist of Warren & Co, that gold is beefed up, intensely documented, and then licensed to users outside the firewall who then have access to robust 3rd-party design blocks, yielding revenue back to the IP developers they would not otherwise enjoy.
So that’s Warren’s business, but what’s really impressive about Warren is the other half of his professional involvement: working through the GSA [Global Semiconductor Alliance] to enhance the well-being of all players in the IP industry, not just his customers. Warren chairs GSA’s Working Group on IP, and leads the Leadership Group subset within that Working Group.
Warren also founded and continues to lead Constellations, a consortium-like group of IP vendors who meet regularly to discuss business issues, develop joint solutions, and host invitation-only events for their customers. The next Constellations event is coming up in early October.
Clearly, Warren Savage is a revolutionary, someone who believes a rising tide raises all boats in the IP industry and acts vigorously on that belief. Warren and I spoke by phone on August 22nd.
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Tags: 3rd-party IP, ARM, ColdFire, Compact JTAG, Constellations, DAC, EDAC, Freescale, Global Semiconductor Alliance, GSA, GSA IP Working Group, Infineon, Intel, IPextreme, MIPS, PowerPC, Reuse Methodology Manual, Silicon IP, Synopsys, VSIA, Warren Savage
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