Posts Tagged ‘Rambus’
Thursday, October 5th, 2017
Hangzhou C-SKY Microsystems, a 32-bit CPU vendor, became a member of the ESD Alliance in 2016 and was described at the time as “the first IP company from China to join.”
Founded in 2001, C-Sky has “developed 7 types of embedded CPUs covering a wide range of embedded applications including smart devices in IoT, digital audio and video, information security, network and communications, industrial control and automotive electronics. It is the only embedded CPU volume provider in China with its own instruction set architecture, the Yun-on-Chip architecture developed in conjunction with Alibaba.”
C-Sky is a growing IP company serving an enormous market. I spoke recently by phone with Dr. Xiaoning Qi, CEO at C-Sky, who was in California attending meetings. No stranger to Silicon Valley, he previously served at Intel, Rambus, Synopsys, and Sun, after completing his Ph.D. under Prof. Robert Dutton at Stanford.
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Tags: Aart de Geus, Alibaba, ARM, Asia-Pacific Leadership Council, Bob Smith, C-Sky Microsystem Corp., Chenming Hu, Chi-Foon Chan, Chinese American Semiconductor Professional Association, ESD Alliance, GSA, IEEE, Intel, Mentor Graphics, Microsoft, NB-IoT, Rambus, Robert Dutton, SMIC, Stanford, Subhasish Mitra, Sun Microsystems, Synopsys, TSMC, Wally Rhines, Xiaoning Qi, ZTE
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Thursday, September 22nd, 2016
Geoff Tate, founding CEO at Rambus, is busy – again. These days he’s leading the charge with a new FPGA-based enterprise that, per Tate, wants to be “the first to the party” – a party that’s all about providing FGPA-based IP to a market increasingly in need of these products.
When Tate and I spoke by phone recently, he offered the Flex Logix elevator pitch, and then focused on the company’s August press release.
“We are like the ARM of FPGA,” Tate said, and then laughed. “No, we are not expecting to be acquired by SoftBank anytime soon.”
“However, ARM was the first to successfully embed processors,” he said, “and at Flex Logic we are [doing that] with FPGAs.”
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Tags: AMD, ARM, Cadence, Cheng Wang, Cypress Semiconductor, Dan Markovic, Eclipse Ventures, eFPGA, Flex Logic, Geoff Tate, Lux Capital, Mellanox, Mentor Graphics, Microchips, National Semiconductor, Pierre Lamond, Rambus, reconfigurable RTL blocks, SoftBank, Synopsys, TSMC 40ULP, UCLA
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Thursday, October 2nd, 2014
This blog requires a long, tall cup of coffee: Go get one, put your feet up, and plow on through. ARM TechCon 2014 took place this week at the Santa Clara Convention Center, and as an indication of what the industry feels is important right now, the following is a complex snapshot of press releases issued by various TechCon exhibitors highlighting their progress in the days leading up to and including the show. Listed first are the three main ARM press releases, then the other exhibitors are showcased.
By the way, the answer to what the industry thinks is important today? If the following is any indication, it’s IoT all the way down, with a dollop of FinFET and low-power thrown in for good measure. And if you don’t know IoT means Internet of Things, you haven’t been listening – particularly as Freescale says in their Press Release: “Analyst research firm Gartner estimates that the IoT will include 26 billion units installed by 2020, and by that time, IoT product and service suppliers will generate incremental revenue exceeding $300 billion, mostly in services.”
Another possible conclusion from the following: If you’re still holding out hope the Design Automation Conference is anchor tenant of the conference year, you should let that go. The amount of news these companies are releasing around ARM TechCon far out weighs what they’re releasing around DAC.
** ARM announced on October 1st “two new physical IP implementation solutions for its silicon partners to help simplify the path to implementation for their FinFET physical designs. ARM Artisan Power Grid Architect will reduce overall design time by creating optimal SoC power grid layouts, while ARM Artisan Signoff Architect increases accuracy and precision in managing on-chip variation over existing methodologies. These new physical IP implementation solutions strengthen the commitment from ARM to enable delivery of real silicon with the speed consumers are demanding.”
** ARM announced on October 1st, mbed OS, a free operating system for ARM Cortex-M processor based devices that consolidates the fundamental building blocks of the IoT in one integrated set of software components; mbed Device Server, a licensable software product that provides the required server-side technologies to connect and manage devices in a secure way, that also provides a bridge between the protocols designed for use on IoT devices and the APIs that are used by web developers; and mbed.org, the focus point for a community of more than 70,000 developers around mbed. The website provides a comprehensive database of hardware development kits, a repository for reusable software components, reference applications, documentation and web-based development tools.
** ARM and TSMC announced on October 2nd a new multi-year agreement that will deliver up ARMv8-A processor IP optimized for TSMC 10FinFET process technology. Per the Press Release: “Because of the success in scaling from 20SoC to 16FinFET, ARM and TSMC have decided to collaborate again for 10FinFET. This early path-finding work will provide valuable learning to enable physical design IP and methodologies in support of customers to tape-out 10FinFET designs as early as Q4 2015.”
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Tags: Acacia Communications, Airbus Defence and Space, Aldec, Altium Ltd., AMD, ANSYS, AppliedMicro, ARicent, ARM, ARM TechCon 2014, Arteris, ASSET InterTech, Atmel, Avago Technologies, Aviva Energy Corp., Cadence, Carbon Design Systems, Cavium, Cisco, Codasip, Doulos, Esterel, Express Logic, FreeBSD Foundation, Freescale, Gartner, GlobalFoundries, Green Hills Software, HP, IAR Systems, Intel, Internet of Things, IPSO Alliance, Lauterbach, LogMeIn, Mentor Graphics, Micrium, MontaVista Software, Mouser Electronics, Open-Silicon, P&E Microcomputer Systems, Rambus, Real Intent, Renesas Electronics, S2C, Samsung Electronics, SatixFy Ltd., SeeControl, SEGGER, Si2, SOMNIUM Technologies, Sonics, Spansion, STMicro, Synopsys, SYSGO, Teledyne LeCroy, TI, Toradex, TSMC, Undo Software, Uniquify, VanGogh Imaging, Vector Software, Wind River, Xilinx, XMOS, Zebra Technologies, Zuse Institute Berlin
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Thursday, May 22nd, 2014
It’s just amazing that DAC has become so thoroughly a show about IP that there are two major parties happening in San Francisco in June that have IP in their name: HOT IP Party and Stars of IP Party.
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Tags: AdaptIP, ARM, Atrenta, Cadence, CAST, Certus, DAC 2014, Dassault Systemes, Denali, Design Automation Conference, HOT IP Party, IPextreme, Jim Hogan, Rambus, Semico, SFCASA, Sonics, Stars of IP Party, Synopsys, TrueCircuits, TSMC, Warren Savage
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