What's PR got to do with it? Posts Tagged ‘semiconductors’What is the IoT?…Jim Hogan convenes discussion at DACTuesday, May 20th, 2014
As DAC frenzy hits us all, here’s an event that EDA/IP users and media people ought to consider attending.
It’s a Jim Hogan-moderated discussion event on IoT system design concerns Jim will 1) introduce the topic; 2) spur, moderate, provoke discussion and 3) sum up what we’ve learned during this session. Of course, this group of speakers are pretty opinionated and won’t need much provocation. Tough job: SKTA Innopartners on rebuilding the semiconductor ecosystemTuesday, May 13th, 2014Electronics360’s George Leopold explores SKTA Innopartners and their unique business incubator model in this article: Technology Incubator 2.0 Seeks to Rebuild U.S. Chip Ecosystem  Accelerator Model
You’ve got problems with your design rule deck?Tuesday, May 6th, 2014You’ve got problems with your design rule deck? See what Bryon Moyer and Peggy Aycinena have to say on how to fix those problems…… Testing Out the Rules by Bryon Moyer Sage-DA: Automating rule checking by Peggy Aycinena Come check out Sage-DA at Booth 1423 at the Design Automation Conference. Lee PR does work for Sage-DA.
Real RTL Signoff™ is a Comprehensive SignoffMonday, March 17th, 2014
Liz: Piyush, thanks for taking the time out to chat with me today on this vital topic…RTL Signoff. Piyush: No problem, Liz Liz: So, to start out, what is RTL Signoff? Piyush: “RTL Signoff” gained momentum as an established concept in 2013. While the concept is not new, a commonly-accepted definition did not exist in the past, which is now beginning to emerge. Here’s what I think RTL Signoff is: a comprehensive series of well-defined MUST-pass requirements for your RTL before you commit the design to downstream implementation such as synthesis and physical layout. In addition to this complete set of RTL Signoff requirements, you need tools and methodologies to meet the requirement, along with tangible metrics to measure your pass/fail criteria. HOW will EDA/IP get beyond the horizon?Sunday, March 16th, 2014
The question is: HOW will EDA/IP get beyond the component level and start looking at what’s beyond the 25-year EDA horizon and how EDA can and must add value. Brian and I would love to hear what readers out there think….. Does EDA & IP need to go beyond? Where does it need to go? And how will it get there? How do software and hardware come together?Wednesday, March 12th, 2014
Software is beginning to take on a bigger role in the SoC design world. How do we get to SW-HW co-verification? This topic was the center of discussion at a private event last week co-located with DVCon. The event, hosted by Jim Hogan and sponsored by Vayavya Labs Pvt. Ltd., included a panel discussion with Frank Schirrmeister (Cadence), Tomas Evensen (Xilinx) and Parag Naik (Saankhya). George Lotridge of VMware and Michael Bair of Intel also gave presentations. Click here for the presentations. (more…) Predictions 2014: Chris Rowen talks EDA and IP….and BeyondMonday, March 3rd, 2014
What do EDA and IP (as an industry) need to do in 2014 to serve its user base better? Chris Rowen, Cadence Fellow and Tensilica Founder, will wrap it up with his word on the subject. “What does the EDA and IP industry need to do in 2014? Simply put, we need to move past EDA. Let me explain. As an industry, we’re not just about ‘how’ you design something; we’re increasingly about ‘what’ you design. This comes amid the relentless march of design complexity. It also comes as companies reconsider their position in the electronics ecosystem to try to deliver more value for customers. For instance, semiconductor vendors are considering where they best fit into the design spectrum and they’re also looking farther upstream to understand market requirements of their customers’ customers. IP providers, for their part, are looking upstream to understand marketing technology requirements better and re-engineering their business models. Predictions 2014: Sumit DasGupta on ensuring a vibrant semiconductor industryWednesday, February 26th, 2014
“As the new year rolls out, there are promises and associated challenges that the semiconductor industry faces that need attention to ensure the vibrancy of the industry, even as the industry struggles to stay on the Moore’s law trajectory. First in my list is the area of 2.5D and 3D integration, an area of great promise but with significant challenges. Much has been touted about these approaches as ways to deliver “More than Moore” but it appears to this observer to be advancing at a pace that is slower than hoped for. It seems to be just another year away from full production. But now, enough said, 2014 needs to be the year when much greater focus must be applied to get at least 2.5D technology into mass production. This is not a transitory approach to 3D but rather should last longer in its own right as a very viable technology sitting alongside 3D as 2 approaches to semiconductor integration. 3D still has challenges to be addressed but here again, greater focus needs to be applied to ramp up to full production in 2015. Predictions for 2014: Warren Savage on the IoT eraMonday, February 24th, 2014
Next up in our series of predictions Warren Savage, President and CEO of IPextreme, shares with us what he sees in his crystal ball for 2014.
“As the door closes on a successful 2013 for most companies in the semiconductor industry, the outlook for 2014 is bright as we see an explosion of new devices in the so-called “Internet of Things” era. Google’s recent $3.2B acquisition of Nest is indicative that this market will soon eclipse the smart phone/tablet era (aka the post-PC era). The IoT era will bring with it a range of new opportunities for semiconductor companies to exploit that are not mega-devices, but small, specialized technologies that enable opportunities in adjacent markets, like software and data analysis. There may be at least one semiconductor company that exploits this secondary and/or tertiary source of revenue. (more…) Predictions 2014: Bob Smith on the watchword for the semiconductor industryWednesday, February 19th, 2014
“If 2014 has a watchword for the Semiconductor Industry, it would be momentum and that would be a result of the rapidly increasing use of IP in SoC designs. Add on the mushrooming need for ‘adaptive’ IP to mitigate timing and variation challenges in complex SoCs as performance issues multiply and process geometries shrink. Moves within the DDR memory space continue to rock the industry and create momentum. Designers are heading directly to the latest JEDEC standard LPDDR4 (low-power DDR4) and moving beyond (or even skipping) LPDDR3 because they’re getting greater gains in performance and low power, an important consideration for mobile applications. |
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