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Posts Tagged ‘ARM TechCon 2015’

Austin to ARM: Aristocracy to Meritocracy

Wednesday, September 9th, 2015

 


ARM must be doing something right
when among the eight corporate sponsors for their upcoming Silicon Valley users conference in November, the top three companies in EDA are listed as Diamond or Platinum.

Cadence is Diamond, undoubtedly, because company President & CEO Lip-Bu Tan is co-chair of EDAC, and ARM CEO Simon Segars is on the EDAC Board. But why would Mentor and Synposys spend good money being Platinum sponsors of ARM’s show when they could put that particular chunk of disposable income into their own user conferences, or even DAC? Particularly since Mentor and Synopsys sell IP, as does Cadence, so in some ways the three EDA companies may actually be competing with ARM.

There are three possible answers: A) Mentor, Synopsys, and Cadence serve as channels for ARM products. B) Mentor, Synopsys, and Cadence want to see, and be seen by, ARM’s enormous worldwide customer base. C) ARM has the winning hand in today’s semiconductor supply chain, so either the Big Three in EDA pony up to help sponsor ARM TechCon, or the UK-based IP behemoth won’t cooperate in the EDA world; they won’t offer pointers or tool-development advice for the third-party design software that EDA vendors sell and ARM customers [might] buy.

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Vacation’s over: Autumn Conferences Ramp-up

Wednesday, August 12th, 2015

 

Autumn used to start in September, but now classes and conferences commence in August and vacation ends just that much sooner. Here’s a list of various events you should consider attending between now and the end of the year, with thanks to conference organizers for the associated descriptions.

Scanning the range of topics, it’s clear the combined IP and EDA industries have an increasingly broad range of interests: IoT, autos, wearables, software security, verifying/integrating IP, power, device physics, memory, embedded processors and software, sensors, MEMS, a range of standards, networking, both the professional and technical kinds, and “synergistic collaborative design” both upĀ in the cloud and down below on solid ground.

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