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Posts Tagged ‘3D ASIP’

Vacation’s over: Autumn Conferences Ramp-up

Wednesday, August 12th, 2015

 

Autumn used to start in September, but now classes and conferences commence in August and vacation ends just that much sooner. Here’s a list of various events you should consider attending between now and the end of the year, with thanks to conference organizers for the associated descriptions.

Scanning the range of topics, it’s clear the combined IP and EDA industries have an increasingly broad range of interests: IoT, autos, wearables, software security, verifying/integrating IP, power, device physics, memory, embedded processors and software, sensors, MEMS, a range of standards, networking, both the professional and technical kinds, and “synergistic collaborative design” both upĀ in the cloud and down below on solid ground.

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