According to a Reuters report, the Biden administration plans next month to broaden curbs on U.S. shipments to China of AI chips and semiconductor equipment. The new regulations would be based on restrictions communicated in letters earlier this year to KLA, Lam Research and Applied Materials. The letters forbade these companies from exporting chipmaking equipment to Chinese factories that produce chips with sub-14 nanometer processes unless the sellers obtain Commerce Department licenses. Some of the sources quoted by Reuters said the regulations would likely include additional actions against China.
Cadence new verification platform
The new Cadence Verisium AI-Driven Verification Platform is a suite of applications leveraging big data and AI to optimize verification workloads, boost coverage and accelerate root cause analysis of bugs. Verisium is built on the new Cadence Joint Enterprise Data and AI (JedAI) Platform and is natively integrated with the Cadence verification engines. The initial suite in the Verisium platform includes multiple apps using machine learning to automate tasks such as regression failure triage; pinpoint potential bug hotspots caused by source code revisions; analyze waveforms looking for the root cause of a test failure; predict which source code check-ins are most likely to have introduced failures. More Verisium apps offer a debug solution from IP to SoC and from single-run to multi-run; and full flow IP and SoC-level verification management.
