Posts Tagged ‘Semiconductor IP’
Thursday, October 16th, 2014
This article by Atrenta’s CTO Bernard Murphy and investor Jim Hogan has attracted a lot of interest.
Murphy and Hogan say that we can draw inspiration from biology on how to design the IoT fortress: specifically, how the human body wards off attacks from bacteria, viruses, other bad and harmful stuff.
And they describe in detail the concept on how electronic engineers can plan to do so.
It’s an intriguing piece that gives electronic designers a first huge step on how to secure the IoT and keep those of us who are IoT-interconnected – Borg Collective like – protected from the inevitable cyber attacks.
Biology, Deceit & Security in the Internet of Things
What do you think?
Tags: Atrenta, Bernard Murphy, Biology, Borg Collective, Chip Design, cyber attack, Cyber Security, EDA, EDA & IP, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Security, Semiconductor IP, semiconductors, SoC, Star Trek: Next Generation, System on Chip, VistaVentures LLC, www.leepr.com
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Monday, August 25th, 2014
The EDA editorial brain trust today is the topic of our continuing conversation with Richard Goering and Brian Fuller.
 Brian Fuller  Richard Goering
ED: What is the EDA editorial brain trust these days?
RICHARD: Not sure how you’re defining “brain trust,” but if there is one, it’s with the vendors and the independent on-line publications.
ED: Who makes up the EDA editorial brain trust?
RICHARD: If you add it all up, there are still a number of editors with deep EDA and semiconductor experience – they’re just no longer with print publications.
Additionally, there are now a number of writers and bloggers who didn’t start as journalists but who turned in that direction during the transition away from print.
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Tags: Brian Bailey, Brian Fuller, Cadence, Chip Design, Colin Walls, DAC, Dan Nenni, Design Automation Conference, EDA, EDA & IP, EE Times, Electronic Design Automation, Frank Schirrmeister, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Jerry Grzenia, John Cooley, John Day, Lee PR, Lee Public Relations, Michael Posner, Mike Santarini, Paul McLellan, Paul Rako, Peggy Aycinena, Richard Goering, Ron Wilson, Semiconductor Engineering, Semiconductor IP, SemiWiki, SoC, social media, System on Chip, Tom De Schutter, www.leepr.com
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Monday, July 28th, 2014
In our continuing series on the IoT, Frank Schirrmeister of Cadence explains what three components of the IoT are important to him.
 Schirrmeister: There are three components of importance. Fitbit. ARM’s going very big in that area, with their silicon partners. That’s not the IoT in its completeness. That’s an important component, but the analog mixed-signal components are certainly fun and challenging in this domain.
Then there are two more pieces to the Internet of Things that make me very happy, from a system design perspective: The first one is the hub of my data from the Fitbit. I have at least four hubs that I’m concerned about. My cell phone when I’m mobile. My computer at home. My living room; apparently my TV knows about my habits.
And there is my car. So that’s a hub – a very important piece. And from a system design perspective, there’s system development, emulation, FPGA, virtualization. There is a huge interesting market for us.
Then the third piece is this whole cloud space. That’s where the Intel, ARM, PC battle is waging. And that’s also a very important component of the Internet of Things where all the data crunching has happened and the health data that the health monitor needs to pick up. It is a very attractive market for EDA and will be very important to drive requirements, as well, for us.
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Tags: 51DAC, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, SoC, System on Chip, www.leepr.com
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Tuesday, July 22nd, 2014
In today’s snippet from the IoT panel, Randy Smith, VP of Marketing at Sonics, gives his views on how the IoT will affect the EDA and IP industries.
Smith: Time to Market will be more important. The need for software-hardware co-design and speed will equal new applications and solutions for EDA.
A lot of it will be in consumer, which is why there is a lot of hype, because when we think consumer, we think high volumes, perhaps a trillion devices out there. But what’s different in that market as compared to some other markets is that time to market is so much more critical.
So for IoT, you’re going to need the equivalent of agile software development and hardware. You’re going to need to respin that design in three months. It would not be a tremendous surprise if you see some previous ASIC practices like gate arrays start to get more traction again.
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Tags: Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IP, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, Semiconductor IP, semiconductors, SoC, Sonics, System on Chip, www.leepr.com
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Wednesday, April 30th, 2014
In a recent blog entry we asked Chris Rowen, Cadence Fellow and Tensilica Founder, to share with us what EDA and IP (as an industry) need to do in 2014 to serve its user base better. The following is a follow-up blog by Rowen explaining how.
System-design Evolution Follows the Data
When last we chatted in this forum, I responded to a question Ed Lee proposed to this as part of the Predictions 2014 series: What do EDA and IP (as an industry) need to do in 2014 to serve its user base better?
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Tags: Cadence, Chip Design, Chris Rowen, EDA, EDA & IP, EDA tools, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, IP blocks, IP vendors, microprocessor design, semiconductor design, Semiconductor IP, SoC, System on Chip, Tensilica, www.leepr.com
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Monday, March 17th, 2014
 RTL Signoff is certainly one of the hot topics in chip design circles lately, and one that is garnering great interest and concern. I chatted recently with Piyush Sancheti, VP of Marketing at Atrenta, on what it is, why it’s a design imperative, and how it should be done.
Liz: Piyush, thanks for taking the time out to chat with me today on this vital topic…RTL Signoff.
Piyush: No problem, Liz
Liz: So, to start out, what is RTL Signoff?
Piyush: “RTL Signoff” gained momentum as an established concept in 2013. While the concept is not new, a commonly-accepted definition did not exist in the past, which is now beginning to emerge. Here’s what I think RTL Signoff is: a comprehensive series of well-defined MUST-pass requirements for your RTL before you commit the design to downstream implementation such as synthesis and physical layout. In addition to this complete set of RTL Signoff requirements, you need tools and methodologies to meet the requirement, along with tangible metrics to measure your pass/fail criteria.
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Tags: Atrenta, Chip Design, EDA, EDA & IP, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Intellectual property, IP, Piyush Sancheti, register transfer level, RTL, RTL signoff, Semiconductor IP, semiconductors, SoC, System on Chip, www.leepr.com
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Sunday, March 16th, 2014
Brian Fuller - editor in chief of the now-lamented EE Times during its best years - and I were talking about it being great that there are these predictions about where EDA/IP is going in 2014. Chris Rowen’s wrap up prediction talked about EDA’s need to move beyond component – level focus. Chris isn’t alone in this idea.
The question is: HOW will EDA/IP get beyond the component level and start looking at what’s beyond the 25-year EDA horizon and how EDA can and must add value.
Brian and I would love to hear what readers out there think…..
Does EDA & IP need to go beyond?
Where does it need to go?
And how will it get there?
Tags: Brian Fuller, Cadence, Chip Design, Chris Rowen, EDA, EDA & IP, EE Times, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Intellectual property, IP, Lee PR, Semiconductor IP, semiconductors, SoC, System on Chip, www.leepr.com
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Monday, March 3rd, 2014
 For our final entry to this series, let me just reiterate our original question…..
What do EDA and IP (as an industry) need to do in 2014 to serve its user base better?
Chris Rowen, Cadence Fellow and Tensilica Founder, will wrap it up with his word on the subject.
“What does the EDA and IP industry need to do in 2014? Simply put, we need to move past EDA.
Let me explain. As an industry, we’re not just about ‘how’ you design something; we’re increasingly about ‘what’ you design.
This comes amid the relentless march of design complexity. It also comes as companies reconsider their position in the electronics ecosystem to try to deliver more value for customers.
For instance, semiconductor vendors are considering where they best fit into the design spectrum and they’re also looking farther upstream to understand market requirements of their customers’ customers. IP providers, for their part, are looking upstream to understand marketing technology requirements better and re-engineering their business models.
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Tags: Cadence, Chip Design, Chris Rowen, EDA, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, IP, Lee PR, Semiconductor IP, semiconductors, SoC, System on Chip, Tensilica, www.leepr.com
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Wednesday, February 26th, 2014
 Retired senior vice president of Si2, Sumit DasGupta, imparts his sage view on what the semiconductor, EDA and IP industries should focus on to ensure a vibrant semiconductor industry for 2014.
“As the new year rolls out, there are promises and associated challenges that the semiconductor industry faces that need attention to ensure the vibrancy of the industry, even as the industry struggles to stay on the Moore’s law trajectory.
First in my list is the area of 2.5D and 3D integration, an area of great promise but with significant challenges. Much has been touted about these approaches as ways to deliver “More than Moore” but it appears to this observer to be advancing at a pace that is slower than hoped for. It seems to be just another year away from full production. But now, enough said, 2014 needs to be the year when much greater focus must be applied to get at least 2.5D technology into mass production. This is not a transitory approach to 3D but rather should last longer in its own right as a very viable technology sitting alongside 3D as 2 approaches to semiconductor integration. 3D still has challenges to be addressed but here again, greater focus needs to be applied to ramp up to full production in 2015.
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Tags: 2.5D, 3D, 3D IC, 3D ICs, 3D stacked die, Chip Design, EDA, Electronic Design Automation, Internet of Things, IoT, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, Si2, SoC, software, stacked die, Sumit DasGupta, System on Chip, www.leepr.com
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Monday, February 24th, 2014
Next up in our series of predictions Warren Savage, President and CEO of IPextreme, shares with us what he sees in his crystal ball for 2014.
“As the door closes on a successful 2013 for most companies in the semiconductor industry, the outlook for 2014 is bright as we see an explosion of new devices in the so-called “Internet of Things” era. Google’s recent $3.2B acquisition of Nest is indicative that this market will soon eclipse the smart phone/tablet era (aka the post-PC era). The IoT era will bring with it a range of new opportunities for semiconductor companies to exploit that are not mega-devices, but small, specialized technologies that enable opportunities in adjacent markets, like software and data analysis. There may be at least one semiconductor company that exploits this secondary and/or tertiary source of revenue. (more…)
Tags: Chip Design, Intellectual property, Internet of Things, IoT, IP, IPextreme, Semiconductor IP, semiconductors, SoC, System on Chip, Warren Savage, www.leepr.com
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