Posts Tagged ‘Lee Public Relations’
Wednesday, July 30th, 2014
More on our coverage of the panel on the IoT……Audience member, Gabe Moretti, had quite a bit to say about the IoT and the automobile. And Jim Hogan shares a story.
 Moretti: Let me talk to you about the very latest model car….The first thing it does when I get in the car is ask me for my cell phone. It connects to my cell phone, and only some of the functions are available to me if I have the cell phone with me…and the cell phone is off. What’s the problem I have with all of us engineers talking about what a great opportunity IoT is? We’re forgetting that supply is only successful if there is a demand.
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Tags: automobiles, Chip Design, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, Gabe Moretti, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, semiconductors, smart cars, SoC, System on Chip, www.leepr.com
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Monday, July 28th, 2014
In our continuing series on the IoT, Frank Schirrmeister of Cadence explains what three components of the IoT are important to him.
 Schirrmeister: There are three components of importance. Fitbit. ARM’s going very big in that area, with their silicon partners. That’s not the IoT in its completeness. That’s an important component, but the analog mixed-signal components are certainly fun and challenging in this domain.
Then there are two more pieces to the Internet of Things that make me very happy, from a system design perspective: The first one is the hub of my data from the Fitbit. I have at least four hubs that I’m concerned about. My cell phone when I’m mobile. My computer at home. My living room; apparently my TV knows about my habits.
And there is my car. So that’s a hub – a very important piece. And from a system design perspective, there’s system development, emulation, FPGA, virtualization. There is a huge interesting market for us.
Then the third piece is this whole cloud space. That’s where the Intel, ARM, PC battle is waging. And that’s also a very important component of the Internet of Things where all the data crunching has happened and the health data that the health monitor needs to pick up. It is a very attractive market for EDA and will be very important to drive requirements, as well, for us.
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Tags: 51DAC, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, SoC, System on Chip, www.leepr.com
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Thursday, July 24th, 2014
Bernard Murphy, CTO of Atrenta, talks about the challenges to security that the IoT will bring in our continuing coverage of the IoT panel at DAC…and sees the IoT as a lot like a biological system!!!!
 Murphy: The IoT represents a new level of challenge for security – not just because you have to worry about automotive, medical and so on. But also, if you believe the numbers, then the number of potential edge nodes in an IoT is on the order of a trillion or more. That’s two to three orders of magnitude bigger than any existing network you can imagine. It’s about the number of cells you find in a new born baby.
So a trillion edge nodes looks like a biological system. Why is that relevant? Because our approach to security today is very atomic….It’s not a system level approach. You think in terms of system level and you look at analogies with biological systems, then you think in terms of different things.
Of course, you need all the antibodies and antiviruses. But you also want to think about things like signaling – help I’m under attack. It’s not the same thing as defending yourself. You still want to defend. But you also want to signal to your nearest neighbors or an organization around you that you’re under attack. It can isolate you or send in defenses.
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Tags: 51DAC, Atrenta, Chip Design, DAC, Design Automation Conference, EDA, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Security, semiconductors, SoC, System on Chip, www.leepr.com
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Tuesday, July 22nd, 2014
In today’s snippet from the IoT panel, Randy Smith, VP of Marketing at Sonics, gives his views on how the IoT will affect the EDA and IP industries.
Smith: Time to Market will be more important. The need for software-hardware co-design and speed will equal new applications and solutions for EDA.
A lot of it will be in consumer, which is why there is a lot of hype, because when we think consumer, we think high volumes, perhaps a trillion devices out there. But what’s different in that market as compared to some other markets is that time to market is so much more critical.
So for IoT, you’re going to need the equivalent of agile software development and hardware. You’re going to need to respin that design in three months. It would not be a tremendous surprise if you see some previous ASIC practices like gate arrays start to get more traction again.
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Tags: Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IP, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, Semiconductor IP, semiconductors, SoC, Sonics, System on Chip, www.leepr.com
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Monday, July 21st, 2014
As we had previously announced, venture capitalist Jim Hogan moderated a panel at DAC regarding the IoT.
 It was an eye opener about all things IoT……or maybe we should call it the IoE (The Internet of Everything), or as one prominent editor noted, the IoW (The Internet of Whatever). Our panelists included: Gary Smith, Market Analyst, GSEDA; Frank Schirrmeister, Group Director, System Development Suite, Cadence; Bernard Murphy, CTO, Atrenta; and Randy Smith, VP of Marketing, Sonics.
Very lively discussion among panelists, but also from the floor! Most notably editor Gabe Moretti of Chip Design and Simon Bloch of Samsung. Bloch, Sr. Director of R&D in mobile consumer wireless devices, posed questions and stimulated discussion to the point where he might be called the unannounced 6th panelist.
Over the next few blogposts, we’ll share snippets of that discussion. Gary Smith will start us off…..
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Tags: 51DAC, Atrenta, Bernard Murphy, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, Gary Smith, GSEDA, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, IP, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, semiconductors, SoC, Sonics, System on Chip, VC, Wall Street, www.leepr.com
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Tuesday, May 20th, 2014
As DAC frenzy hits us all, here’s an event that EDA/IP users and media people ought to consider attending.
It’s a Jim Hogan-moderated discussion event on
IoT system design concerns
Jim will 1) introduce the topic; 2) spur, moderate, provoke discussion and 3) sum up what we’ve learned during this session. Of course, this group of speakers are pretty opinionated and won’t need much provocation.
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Tags: Atrenta, Bernard Murphy, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, functional verification, Gary Smith, GSEDA, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, register transfer level, RTL, semiconductors, SoC, Sonics, System on Chip
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Wednesday, February 26th, 2014
 Retired senior vice president of Si2, Sumit DasGupta, imparts his sage view on what the semiconductor, EDA and IP industries should focus on to ensure a vibrant semiconductor industry for 2014.
“As the new year rolls out, there are promises and associated challenges that the semiconductor industry faces that need attention to ensure the vibrancy of the industry, even as the industry struggles to stay on the Moore’s law trajectory.
First in my list is the area of 2.5D and 3D integration, an area of great promise but with significant challenges. Much has been touted about these approaches as ways to deliver “More than Moore” but it appears to this observer to be advancing at a pace that is slower than hoped for. It seems to be just another year away from full production. But now, enough said, 2014 needs to be the year when much greater focus must be applied to get at least 2.5D technology into mass production. This is not a transitory approach to 3D but rather should last longer in its own right as a very viable technology sitting alongside 3D as 2 approaches to semiconductor integration. 3D still has challenges to be addressed but here again, greater focus needs to be applied to ramp up to full production in 2015.
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Tags: 2.5D, 3D, 3D IC, 3D ICs, 3D stacked die, Chip Design, EDA, Electronic Design Automation, Internet of Things, IoT, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, Si2, SoC, software, stacked die, Sumit DasGupta, System on Chip, www.leepr.com
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Wednesday, February 19th, 2014
 Bob Smith, Senior VP Marketing & Business Development at Uniquify, shared with us his predictions for semiconductor IP in 2014.
“If 2014 has a watchword for the Semiconductor Industry, it would be momentum and that would be a result of the rapidly increasing use of IP in SoC designs. Add on the mushrooming need for ‘adaptive’ IP to mitigate timing and variation challenges in complex SoCs as performance issues multiply and process geometries shrink.
Moves within the DDR memory space continue to rock the industry and create momentum. Designers are heading directly to the latest JEDEC standard LPDDR4 (low-power DDR4) and moving beyond (or even skipping) LPDDR3 because they’re getting greater gains in performance and low power, an important consideration for mobile applications.
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Tags: Bob Smith, Chip Design, DDR, EDA, Electronic Design Automation, Intellectual property, IP, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, SoC, System on Chip, Uniquify, www.leepr.com
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Monday, February 17th, 2014
Next up in our series of predictions is the astute insight of Mike Demler, Senior Analyst with The Linley Group & MICROPROCESSOR report, and former EDA & Chip Design news analyst.
“It’s all about the ecosystem triad: EDA + foundry + IP. Cadence and Synopsys continue to evolve more in the IP direction, and there is really not much to say about the tools that hasn’t been said for a long time —just make it all work together! Redundant “standards” and artificial barriers to interoperability cost the semiconductor industry by lowering productivity. This is the problem with the disaggregated model. Back in the days when “real men” had fabs, companies could develop complete design flows without such obstacles.
The triad needs to work together to get over the stall inMoore’s Law at 28nm. Foundries are incurring delays in getting to 16/14nm FinFETS, and almost nobody is going to use 20nm. The chip industry needs an overall lower-cost solution in order to make sub-28nm processes economically viable. Forget 3D ICs, those will be niche products for a long time, about as popular as 3D TV.
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Tags: 3D ICs, Cadence, Chip Design, EDA, EDA & IP, Electronic Design Automation, FinFETs, foundries, foundry, Intellectual property, Lee Public Relations, Mike Demler, Moore's Law, Semiconductor IP, semiconductors, SoC, Synopsys, System on Chip, The Linley Group, wearables, www.leepr.com
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Wednesday, February 12th, 2014
Bryon Moyer, Technology Editor at EE Journal, weighs in on what the chip industry needs from EDA and IP in 2014.
“At the low level, this is going to be the year where the push and pull between EDA companies and users determines how easy FinFETs are to design with.
At the high level, it feels to me like IP and EDA need to come closer together. For years, logic design has been done using text because higher-level languages allow better design abstraction and productivity for hand-crafted designs than prior schematic approaches did. When IP entered the scene, designs were mostly hand-done, with occasional bits farmed out to IP. But now IP dominates, whether internal or third-party. Rather than having a custom-logic paradigm that accommodates IP, it feels like we need to move more to an IP paradigm that accommodates custom logic. And it’s not just about logic either: mixed signal is everywhere, and should be included more seamlessly.”
Tags: Bryon Moyer, Chip Design, EDA, EDA & IP, EE Journal, Electronic Design Automation, FinFETs, Intellectual property, IP, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, SoC, System on Chip, www.leepr.com
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Moretti: Let me talk to you about the very latest model car….The first thing it does when I get in the car is ask me for my cell phone. It connects to my cell phone, and only some of the functions are available to me if I have the cell phone with me…and the cell phone is off. What’s the problem I have with all of us engineers talking about what a great opportunity IoT is? We’re forgetting that supply is only successful if there is a demand.
