Archive for the ‘Uncategorized’ Category
Monday, August 25th, 2014
The EDA editorial brain trust today is the topic of our continuing conversation with Richard Goering and Brian Fuller.
Brian Fuller
Richard Goering
ED: What is the EDA editorial brain trust these days?
RICHARD: Not sure how you’re defining “brain trust,” but if there is one, it’s with the vendors and the independent on-line publications.
ED: Who makes up the EDA editorial brain trust?
RICHARD: If you add it all up, there are still a number of editors with deep EDA and semiconductor experience – they’re just no longer with print publications.
Additionally, there are now a number of writers and bloggers who didn’t start as journalists but who turned in that direction during the transition away from print.
(more…)
Tags: Brian Bailey, Brian Fuller, Cadence, Chip Design, Colin Walls, DAC, Dan Nenni, Design Automation Conference, EDA, EDA & IP, EE Times, Electronic Design Automation, Frank Schirrmeister, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Jerry Grzenia, John Cooley, John Day, Lee PR, Lee Public Relations, Michael Posner, Mike Santarini, Paul McLellan, Paul Rako, Peggy Aycinena, Richard Goering, Ron Wilson, Semiconductor Engineering, Semiconductor IP, SemiWiki, SoC, social media, System on Chip, Tom De Schutter, www.leepr.com 2 Comments »
Sunday, August 17th, 2014
There once was a golden age for EDA editorial. Seems funny to say nowadays, when we see EDA editorial in a virtual shambles…where one or two publications gamely soldier on as pure play editorial ventures…while others have adopted various sponsorship business models, thereby incurring the snide, not-accurate accusation of being pay-for-play vehicles.
Among the handful of first-tier publications back around the turn of the century, EE Times clearly was the go-to book for EDA. Staffed by a corps of editors who brought their sharp, keen-edged industry knowledge to their reporting, no EDA startup thought they launched themselves successfully without being covered in EE Times. And the formula worked for quite a while. I still remember how those 240 page tomes came to the mailbox each week.
There were two people who figured prominently in the EE Times braintrust.
Brian Fuller, as editor-in-chief, oversaw and created much of what was successful for the various sections that covered all of electronic design. And there was Richard Goering, the longtime EDA editor with his imposing manner, startling industry knowledge and contacts. Richard was perhaps best known for refusing to allow canned presentations during interviews. He’d ask for material before the interview, then start off the interview with those famous words, “I’ve looked over your material and have a few questions,” and run the 30 -45 minute interview. It was a little like Steve Jobs saying, “Oh, and one more thing.”
EDA editorial has changed, needless to say. Fortunately, we have Fuller and Goering here to talk a little about what EDA editorial used to be, what it is today, and what we can look toward in the future. We’ll post their thoughts over the next several weeks, usually on a Monday.
I can’t think of any individuals more qualified to speak cogently on this subject.
Brian Fuller
Richard Goering
ED: Brian, Richard, thanks for taking time to reminisce a little and to analyze and speculate about where we’re at now. So let me kick it off with this question:
What’s happened to electronic design editorial and where is it today?
BRIAN: Ed, to your question what’s happened to electronic design editorial is pretty simple: it’s still there…it’s just in a different place.
ED: I keep referring to a golden age for EDA editorial. There was one, wasn’t there?
BRIAN: Yes, there was! Think back 20 years ago and you had at least three major publications with EDA editors of one type or another: EDN, Electronic Design, EE Times, Electronic News (not to mention overseas publications).
ED: There also was Computer Design, the first publication covering EDA to bite the dust.
BRIAN: That’s right!
ED: But I interrupted you…
BRIAN: EE Times, of which I am most familiar, had 2.5 editors at one point covering the design automation industry from the technology and business standpoint.
ED: So what happened?
BRIAN: Well, we all know the backstory since then: In 2001, the dot-com bubble burst. Semiconductor and EDA companies shifted marketing dollars to their own site development and to those publications they thought could deliver more eyeballs.
ED: What about the notion that EDA vendors never bought sufficient advertising and therefore killed their own editorial?
BRIAN: It wasn’t just with EDA, but I think EDA started the ball rolling, and they were big advertisers so the impact was significant. Electronics publications had to prioritize areas that they were going to cover. Paul Miller, then CEO of UBM Electronics, said pretty bluntly “EDA marketers: If you’re not going to support us, we can’t invest in editors.”
That was the end of Mike Santarini at EE Times; just a few years later it was the end of Richard Goering, now my colleague at Cadence.
RICHARD: Well, not really the “end” of Mike or myself; Mike went to Xilinx, and I’m now at Cadence. But I do agree with Brian that a lack of advertising revenues ended my career at EE Times.
ED: So what do we have today?
RICHARD: Not much is left in print. EE Times, EDN and Electronic Design still exist on-line, but in more of a blog format than traditional journalism. Their EDA coverage is limited.
BRIAN: Richard’s right. There isn’t an EDA “press corps” in the old definition of the term. The electronics publishing industry has restructured itself into smaller, more specialized sites with much lower overhead than the traditional electronics publishing houses, and they are quite healthy. Editors do cover EDA from various angles, but they also cover lithography and foundry and SoC design and so on.
These are outfits like SemiWiki, EE Journal and its sister publications, Semiconductor Engineering, Chip Design Magazineand so on.
Over this same period, those companies that shifted their marketing dollars away from third-party publishers to build out their own sites, realized they needed content experts, because that¹s never been their strength. So, as more editors have been turned out onto the streets from third-party publishing, industry companies have eagerly snapped them up to build content.
Right now, we have a very interesting mixture of editors working together from two sides of the aisle, if you will, to create technology conversations.
……………………..
So what is the EDA editorial braintrust these days? See what Richard and Brian have to say about it in our next blog.
Tags: Brian Fuller, Cadence, Chip Design, EDA, editorial, EE Journal, EE Times, Electronic Design, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Lee PR, Lee Public Relations, media, news, news media, Richard Goering, Semiconductor Engineering, semiconductors, SemiWiki, SoC, social media, System on Chip, UBM, www.leepr.com No Comments »
Friday, August 1st, 2014
Simon Bloch of Samsung, speaks out from the audience on the IoT, posing some interesting questions for all.
Bloch: I don’t think that there’s a one-size-fits-all IoT. There’s going to be segmentation. And if we end up in technology segmentation it’s going to be in low power, low latency and high bandwidths. They are going to be applicable to different areas. But it appears to me that technology segmentation is going to be driven by software, and not necessarily by hardware.
Perhaps one of the better examples is what Apple did just this week (editor’s note: week of June 2, 2014) by connecting two IoT devices – two operating systems talking to each other.
So there might be multiple technologies or different IOSs for different IoTs. There might be an opportunity in connecting them to a management layer that talks to one another, like in the areas of apps.
So, is there an opportunity for EDA companies? What is that activity and what is the opportunity to complement the classical EDA?
(more…)
Tags: 51DAC, Apple, Chip Design, DAC, Design Automation Conference, EDA, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Samsung, semiconductors, Simon Bloch, SoC, System on Chip, www.leepr.com No Comments »
Wednesday, July 30th, 2014
More on our coverage of the panel on the IoT……Audience member, Gabe Moretti, had quite a bit to say about the IoT and the automobile. And Jim Hogan shares a story.
Moretti: Let me talk to you about the very latest model car….The first thing it does when I get in the car is ask me for my cell phone. It connects to my cell phone, and only some of the functions are available to me if I have the cell phone with me…and the cell phone is off. What’s the problem I have with all of us engineers talking about what a great opportunity IoT is? We’re forgetting that supply is only successful if there is a demand.
(more…)
Tags: automobiles, Chip Design, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, Gabe Moretti, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, semiconductors, smart cars, SoC, System on Chip, www.leepr.com No Comments »
Monday, July 28th, 2014
In our continuing series on the IoT, Frank Schirrmeister of Cadence explains what three components of the IoT are important to him.
Schirrmeister: There are three components of importance. Fitbit. ARM’s going very big in that area, with their silicon partners. That’s not the IoT in its completeness. That’s an important component, but the analog mixed-signal components are certainly fun and challenging in this domain.
Then there are two more pieces to the Internet of Things that make me very happy, from a system design perspective: The first one is the hub of my data from the Fitbit. I have at least four hubs that I’m concerned about. My cell phone when I’m mobile. My computer at home. My living room; apparently my TV knows about my habits.
And there is my car. So that’s a hub – a very important piece. And from a system design perspective, there’s system development, emulation, FPGA, virtualization. There is a huge interesting market for us.
Then the third piece is this whole cloud space. That’s where the Intel, ARM, PC battle is waging. And that’s also a very important component of the Internet of Things where all the data crunching has happened and the health data that the health monitor needs to pick up. It is a very attractive market for EDA and will be very important to drive requirements, as well, for us.
(more…)
Tags: 51DAC, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Semiconductor IP, semiconductors, SoC, System on Chip, www.leepr.com No Comments »
Thursday, July 24th, 2014
Bernard Murphy, CTO of Atrenta, talks about the challenges to security that the IoT will bring in our continuing coverage of the IoT panel at DAC…and sees the IoT as a lot like a biological system!!!!
Murphy: The IoT represents a new level of challenge for security – not just because you have to worry about automotive, medical and so on. But also, if you believe the numbers, then the number of potential edge nodes in an IoT is on the order of a trillion or more. That’s two to three orders of magnitude bigger than any existing network you can imagine. It’s about the number of cells you find in a new born baby.
So a trillion edge nodes looks like a biological system. Why is that relevant? Because our approach to security today is very atomic….It’s not a system level approach. You think in terms of system level and you look at analogies with biological systems, then you think in terms of different things.
Of course, you need all the antibodies and antiviruses. But you also want to think about things like signaling – help I’m under attack. It’s not the same thing as defending yourself. You still want to defend. But you also want to signal to your nearest neighbors or an organization around you that you’re under attack. It can isolate you or send in defenses.
(more…)
Tags: 51DAC, Atrenta, Chip Design, DAC, Design Automation Conference, EDA, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Security, semiconductors, SoC, System on Chip, www.leepr.com 3 Comments »
Tuesday, July 22nd, 2014
In today’s snippet from the IoT panel, Randy Smith, VP of Marketing at Sonics, gives his views on how the IoT will affect the EDA and IP industries.
Smith: Time to Market will be more important. The need for software-hardware co-design and speed will equal new applications and solutions for EDA.
A lot of it will be in consumer, which is why there is a lot of hype, because when we think consumer, we think high volumes, perhaps a trillion devices out there. But what’s different in that market as compared to some other markets is that time to market is so much more critical.
So for IoT, you’re going to need the equivalent of agile software development and hardware. You’re going to need to respin that design in three months. It would not be a tremendous surprise if you see some previous ASIC practices like gate arrays start to get more traction again.
(more…)
Tags: Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IP, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, Semiconductor IP, semiconductors, SoC, Sonics, System on Chip, www.leepr.com No Comments »
Monday, July 21st, 2014
As we had previously announced, venture capitalist Jim Hogan moderated a panel at DAC regarding the IoT.
It was an eye opener about all things IoT……or maybe we should call it the IoE (The Internet of Everything), or as one prominent editor noted, the IoW (The Internet of Whatever). Our panelists included: Gary Smith, Market Analyst, GSEDA; Frank Schirrmeister, Group Director, System Development Suite, Cadence; Bernard Murphy, CTO, Atrenta; and Randy Smith, VP of Marketing, Sonics.
Very lively discussion among panelists, but also from the floor! Most notably editor Gabe Moretti of Chip Design and Simon Bloch of Samsung. Bloch, Sr. Director of R&D in mobile consumer wireless devices, posed questions and stimulated discussion to the point where he might be called the unannounced 6th panelist.
Over the next few blogposts, we’ll share snippets of that discussion. Gary Smith will start us off…..
(more…)
Tags: 51DAC, Atrenta, Bernard Murphy, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, Gary Smith, GSEDA, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, IP, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, semiconductors, SoC, Sonics, System on Chip, VC, Wall Street, www.leepr.com No Comments »
Tuesday, May 20th, 2014
As DAC frenzy hits us all, here’s an event that EDA/IP users and media people ought to consider attending.
It’s a Jim Hogan-moderated discussion event on
IoT system design concerns
Jim will 1) introduce the topic; 2) spur, moderate, provoke discussion and 3) sum up what we’ve learned during this session. Of course, this group of speakers are pretty opinionated and won’t need much provocation.
(more…)
Tags: Atrenta, Bernard Murphy, Cadence, Chip Design, DAC, Design Automation Conference, EDA, EDA & IP, Electronic Design Automation, Frank Schirrmeister, functional verification, Gary Smith, GSEDA, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, Internet of Things, IoT, Jim Hogan, Lee PR, Lee Public Relations, Randy Smith, register transfer level, RTL, semiconductors, SoC, Sonics, System on Chip No Comments »
Tuesday, May 13th, 2014
Electronics360’s George Leopold explores SKTA Innopartners and their unique business incubator model in this article:
Technology Incubator 2.0 Seeks to Rebuild U.S. Chip Ecosystem
Accelerator Model
(more…)
Tags: accelerators, Angel Orrantia, Chip Design, Electronics360, George Leopold, https://www.facebook.com/pages/Lee-Public-Relations/201964499825219?ref=hl, incubators, Innopartners, semiconductors, silicon valley, SK Telecom, SKTA, SKTA Innopartners, SoC, Steve Blank, VC, VC funding, Venture Capital, www.leepr.com No Comments »
|