Archive for the ‘Video Interview’ Category
Friday, August 11th, 2023
A closer look at the new solution with the help of Rob Knoth, Product Management Group Director in the Digital & Signoff Group at Cadence
With its recently announced “Joules RTL Design Studio”, Cadence is offering “a new solution that provides users with actionable intelligence to accelerate the register transfer level (RTL) design and implementation process.” According to Cadence, front-end designers can now access digital design analysis and debugging capabilities from a single, unified cockpit, enabling fully optimized RTL design prior to implementation handoff. For years, Cadence maintains, front-end designers have lacked visibility of RTL metrics on power, performance, area, and congestion (PPAC). Now, with the Joules RTL Design Studio, exploration and prototyping are possible prior to committing the design to the place and route phase.
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Thursday, August 3rd, 2023
Flagship product of the new engineering software company – a spinoff from defense contractor IERUS Technologies – is an electromagnetic simulation software that has been tested on real-world antenna, microwave, and scattering problems for the last twelve years
Wireless applications are getting ever more complex in several key industries such as defense, aerospace, 5G/6G communications, and automotive. Some of the design challenges concern multi- and wideband antennas, active and passive electronically steered arrays, MIMO antennas with complex beamforming, complex microwave networks, cosite interference when multiple antennas are placed on vehicles or aircrafts, and more. Companies developing advanced communication systems rely on electromagnetic simulation software that must combine speed, accuracy and flexibility, to reduce the development time while avoiding design errors.
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Monday, November 14th, 2022
A closer look at the recently announced ‘Joint Enterprise Data and AI’ infrastructure, an AI-driven, big data analytics environment
Announced last September 13, the JedAI platform is the new Cadence AI-driven, big data analytics environment, meant to be tightly integrated with the company’s recently introduced AI-based platforms: Verisium for verification, Cerebrus for implementation, and Optimality for system optimization. Features and benefits of JedAI were described by Rod Metcalfe – Product Management Group Director, Digital and Signoff Group at Cadence – in the video interview he recently gave to EDACafe’s Sanjay Gangal; building on that interview, in this article we will add a few more details with the help of a Cadence white paper – along with the answers provided by Rod and by Kam Kittrell – vice president, Product Management in the Digital & Signoff Group at Cadence – to some additional questions.
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Tuesday, November 1st, 2022
Thanks to real-time integration with the physical design flow and to new optimization algorithms, the solution promises dramatic TAT improvements and significant PPA benefits for large SoCs and multi-die designs – running on single box hardware
Major EDA vendors are launching new products to address the challenges of design closure and ECOs in deep-submicron SoCs. On October 5th Synopsys introduced its new PrimeClosure solution. Jacob Avidan, senior vice president of Engineering for the Silicon Realization Group at Synopsys, described the features of PrimeClosure in the video interview he recently gave to EDACafe’s Sanjay Gangal. Building on that interview, in this article we will add some more details about the new solution by means of the answers that Manoj Chacko, Director of Product Marketing for Synopsys PrimeClosure, provided to our additional questions.
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Monday, October 24th, 2022
Based on a parallel architecture and a ‘distributed optimization engine’, the new automated environment builds on Cadence’s implementation system (Innovus) and timing signoff solution (Tempus), and promises up to 10X faster closure for designs greater than ten million cells
With SoCs targeted at advanced applications getting ever larger and complex, moving from block-level optimization to full-chip design closure has become a challenging and time-consuming task for design teams. The current, manual full-chip closure flow involves many steps and iterations – from assembly, static timing analysis, and optimization and signoff with hundreds of views. According to Cadence, today’s design teams often spend five to seven days per iteration to meet chip-level signoff timing and power requirements, therefore this error-prone process can take designers months to converge.
Additionally, current methodologies are considered inefficient in terms of team collaboration and user experience. Addressing these problems, Cadence has recently launched Certus Closure Solution, an environment aimed at accelerating full-chip design closure by means of a parallel architecture and automation of previously manual tasks. Brandon Bautz – Senior Group Director of Product Management, responsible for the Cadence silicon signoff and verification product lines in the Digital & Signoff Group at Cadence – described the features of Certus in the video interview he recently gave to EDACafe’s Sanjay Gangal. In this article we will add some more details about Certus, building on that video interview and on the answers Bautz provided to our additional questions.
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Friday, September 30th, 2022
A closer look at the new platform – currently focused on debugging – with the help of Cadence’s Matt Graham
With ever-growing device size and complexity, SoC verification has become an extremely challenging task, often requiring more compute time and qualified human resources than any other step in the engineering flow. According to a Cadence estimate, the verification effort can often climb to more than 500 years of compute time – with tens of millions of runs and hundreds of millions of coverage bins, to uncover thousands of bugs. Debugging alone can consume multiple weeks of time of many engineers. In terms of time-to-market, therefore, verification can be considered a key limiting factor and a potential cause of schedule slips. Reconciling a thorough verification coverage with a tight SoC development schedule clearly calls for better productivity through automation, an even more challenging goal. A new approach to improving verification productivity is now proposed by Cadence with its Verisium Artificial Intelligence-Driven Verification Platform – a suite of applications leveraging big data and AI to optimize verification workloads, boost coverage and accelerate root cause analysis of bugs. The Verisium platform is built on the new Cadence Joint Enterprise Data and AI (JedAI) Platform and is natively integrated with the Cadence verification engines. The initial suite of apps available in the Verisium platform is focused on debugging, a very significant part of verification. Matt Graham, group director at Cadence Design Systems, described the Verisium apps in the video interview he recently gave to EDACafe’s Sanjay Gangal; in this article we will summarize his answers and add a few details, as well as the responses he provided to some additional questions.
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Friday, July 29th, 2022
OrCAD and Allegro PCB design technologies, Clarity/Sigrity/Celsius system analysis technologies, and Fidelity CFD software are now available from a SaaS platform, through a consumption-based pricing model
Ease of purchase is undoubtedly one of the reasons for success of many consumer-oriented services provided through the Internet: just type a card number, freely select a quantity or a subscription duration, and you immediately get what you want. With EDA technologies now available through cloud computing platforms, this ease of purchase can also be extended to the use of EDA tools – adding to the main benefit of a Software-as-a-Service model: eliminating the need for expensive infrastructure hardware. These, in short, are the concepts behind OnCloud, the new Cadence e-commerce platform for cloud-based system design and analysis. With OnCloud, the ease of purchase enabled by e-commerce is leveraged to address two types of customer needs: on the one hand, making it easier for the ‘long tail’ of small EDA users to access first-class technologies; on the other hand, enabling big EDA users to cope with workload peaks without purchasing additional licenses. Two Cadence executives – Ben Gu, Vice President of R&D for the Multiphysics System Analysis Business Unit, and Mahesh Turaga, Vice President of Business Development, Cloud – described the OnCloud features in the video interview they recently gave to EDACafe’s Sanjay Gangal; in this article we will add a few details, as well as the answers Turaga provided to some additional questions.
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Friday, July 22nd, 2022
According to the European company specializing in semiconductor design and services, it is now possible to bring an ASIC to market for less than $5 million dollars in upfront investment – and customers lacking semiconductor expertise can lower the risks by outsourcing to Presto the entire ASIC procurement process, from design to delivery
It’s a two-speed world: on the one hand, applications such as smartphones or artificial intelligence accelerators keep pushing the semiconductor industry towards Angstrom-scale process nodes and hundreds of billions transistor counts; on the other hand, many end products in a variety of markets – from industrial to medical and more – are still relying on an electronic box containing a PCB with a number of low-integration ICs and discrete components. Replacing the old-style box with an ASIC would clearly provide multiple benefits to the end product, but manufacturers lacking a semiconductor expertise are concerned by the risks of a complex production process. Targeting this largely untapped market, a France-headquartered company called Presto Engineering is addressing European and American manufacturers with a two-pronged message: ASICs are now cheaper and easier to make than ever before, and risks can be reduced by outsourcing the entire ASIC procurement process – from design to delivery – to Presto. Michel Villemain, CEO of Presto Engineering, described his company’s offering in the video interview he recently gave to EDACafe’s Sanjay Gangal; in this article we will add a few details, as well as the answers he provided to some additional questions.
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Friday, July 15th, 2022
From a chip to another, traveling through a package, a printed circuit board, and another package: the trip of a high-speed electric signal inside a system is fraught with perils. And avoiding that signals arrive weak and ‘dirty’ at their final destinations is just one of the system-level challenges facing designers today: with ever higher package densities, finer PCB traces, and higher frequencies, crucial aspects now include cooling, stress and more. At the system level, therefore, the interactions among electrical, mechanical, electromagnetic and thermal aspects can no longer be neglected. Unfortunately, the combination of so many different parameters generates an immensely large design space, that system designers are supposed to thoroughly explore to find the optimal solution.
Besides being very human-intensive and requiring a lot of time and computing resources, this task is often hindered by organizational ‘silos’ preventing collaboration among experts from different disciplines. Now a new solution from Cadence, called Optimality Explorer, promises a ten times faster system design optimization – with up to a 100X speedup on some designs – by applying artificial intelligence to a “Multi-disciplinary analysis and optimization” (MDAO) approach. Ben Gu, vice president of R&D for the Multiphysics System Analysis Business Unit at Cadence, described Optimality in the video interview he recently gave to EDACafe’s Sanjay Gangal; in this article we will add a few details, as well as the answers he provided to some additional questions.
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Friday, May 13th, 2022
Saving up to 90% by leveraging the cloud ‘spot market’ and avoiding overprovisioning: that’s the promise of Exotanium, a startup enabling users to benefit from Live Virtual Machine Migration – even with stateful workloads – in a transparent way and without interruption
Chip design teams are increasingly resorting to cloud computing, mostly as a way to reduce time-to-market. Running the EDA tools in the cloud, however, can prove extremely expensive, and skyrocketing cloud bills may prevent users from extending the benefits of cloud computing to a larger number of designs. A startup called Exotanium is now offering new solutions to optimize cloud costs, promising savings up to 90%. Cost reduction is obtained by taking advantage, as much as possible, of the cheapest cloud resources (the ones offered through the so-called “spot market”) and by avoiding overprovisioning (that is, paying for cloud resources that are larger in capacity than needed). These achievements were made possible by technologies originally developed at Cornell University (Ithaca, New York). Hakim Weatherspoon, CEO of Exotanium, described the company’s solutions in the video interview he recently gave to EDACafe’s Sanjay Gangal; in this article we will add a few details, as well as the answers provided by Rohan Prakash – Exotanium’s Senior Business Development Manager – to some additional questions.
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