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Archive for September 28th, 2021

Siemens enters the IC power integrity analysis market with a solution for analog, digital and mixed-signal designs of any size

Tuesday, September 28th, 2021

Called mPower, the new software fills an important gap in the EDA market, says Siemens’ Joe Davis

 

Smaller process geometries make electromigration (EM) and voltage drop (IR) analysis more important than ever for new chip designs, as interconnects and material layers get thinner and thinner. At the same time, smaller geometries mean skyrocketing transistor counts, making detailed EM/IR analysis of a full design a daunting task. On top of that, the growth of sensor-based applications leads to larger analog blocks, where the techniques used in digital blocks to simplify EM/IR analysis are not applicable.

Is the EDA industry keeping pace with the ever-harder requirements of power integrity analysis? According to Siemens, until yesterday the answer was no – and this resulted in some critical pain points. “The largest, most complex analog systems are often sent to manufacturing without a detailed EM/IR analysis; simplifications, subsetting the design, less accurate simulators and other ad hoc methods are used as approximations; lack of detailed EM and IR analysis for large-scale analog circuits puts the whole system at risk,” Siemens maintains in a document on this topic. Identifying those pain points as a market opportunity, Siemens is now introducing its new mPower power integrity software for analog, digital and mixed-signal IC designs. Let’s take a closer look at mPower with the help of Joe Davis – Senior Director at Calibre Interfaces, EM/IR Product Management at Siemens – who recently gave a video interview on this topic to Sanjay Gangal from EDACafe.

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