No shortage of interesting news this week – both from the industry and from academia – still it’s worth devoting some space to a Tesla event that took place last month, showing how system-level assembly technologies can make a difference for supercomputers.
Fab and foundry updates: Intel, SMIC, X-Fab, Samsung
Intel’s CEO Pat Gelsinger has reportedly said the company will invest up to €80 billion over the next decade to build new chip fabs in Europe.
According to the Wall Street Journal, SMIC is teaming up with the Shanghai government to build an $8.87 billion chip production line in the city.
Germany-headquartered X-Fab Silicon Foundries is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement with X-Celeprint. Technologies that may be combined include SOI, GaN, GaAs and InP, as well as MEMS. X-Celeprint’s pick-and-place MTP technology stacks and fans-out ultra-thin dies.
Samsung Electronics has reportedly chosen the city of Taylor, Texas, as the site for its planned $17 billion new chip plant – which will be four times larger than Samsung’s existing fab in Austin. To attract the investment, the city of Taylor has reportedly offered Samsung a $314 million worth of tax breaks for the next ten years.
Source: official City of Taylor website
