Archive for the ‘Uncategorized’ Category
Friday, February 17th, 2017
When it comes keeping the growth of design productivity exponential, a key barrier that fell in the past ten years is due to the increasing use of social media, which set free the exchange of focused, expert knowledge, from user to user. On the web we have very helpful company-curated user forums; and often even better, the stack-exchanges which are user curated, where readers up-vote the most helpful content and as a result these are often the very best place to visit to get unstuck from a problem you recognize you have.
These forums and posts are all reactions against the underfunded, or poorly directed tech publishing team, tasked perhaps by marketing (or the simple desire to keep their employment) to only document what works; and never mention an alternative solution.
Of course a web search will also take you to the swampy places where all you find is others who are stuck with similar problems, and they just bemoan that the vendor doesn’t care, or take you through a litany of things they’ve tried that didn’t work. One also finds the beginning of tutorials, part one of what was to be a twenty volume tutorial where the blogger planned to impart the wisdom of the ages for how to build the magical thing – and only part one got written – and even that is now out of date.
So, search works great — when you have an idea what the problem is, and you are following a large crowd who has been there before, and they’ve taken the time to create hints.
Going hands-on at last year’s Designer/IP track session, with no marketeers in sight!
Tuesday, December 20th, 2016
Designer and IP track submissions are due Tuesday, January 24. These sessions have been among the most vibrant DAC elements in recent years based on attendance and anecdotal feedback. Chuck Alpert, my predecessor as DAC chair, explained why in a post last year: “Many of these technologists come for the Designer/IP track, a marketing-free zone aimed squarely at practitioners.”
The good news is that submitting is easy. All you need to do is bang out 100 words and six slides. You can do this, people!
More good news is the excellent industry pros in charge of these tracks.
Thursday, November 10th, 2016
Time is the only critic without ambition. – John Steinbeck
Like many things, DAC looks decidedly different depending on where you sit, and how you experience it. As an attendee, it’s mostly a few days at the start of every summer where you can sample some of the best technical content on the design of circuits and systems, plus get the chance to network and have some fun with a worldwide audience that spans execs to undergrads. In contrast, as a member of the executive committee, DAC is the finish line for a year-long marathon effort to bring the best content, speakers and papers all together in one place and time, building on what works and improving where we can.
Now is the time for a reminder that if you want present a paper at DAC (especially a research paper), the 12-month calendar matters for you as well. Abstracts are due Nov. 15; manuscripts, Nov. 22!
Tuesday, April 26th, 2016
All of a sudden it’s nearly the end of April, high time to switch from months to weeks (just six to go now!) in the countdown to DAC, which I can guarantee is going to be a great conference. One big reason I’m confident is that, as always, we have an excellent lineup of keynoters as worthy of a stage at TED or SxSW as at the world’s premier design automation conference. See my past posts on Peter Stone (Thursday keynote) and Lars Reger (Monday) for a refresher. And don’t forget the luminaries sandwiched between the two of them:
Tuesday back-to-back big thinkers will take the main stage. One is Louis Scheffer, a researcher at Howard Hughes Medical Institute. Shcheffer has spent a lifetime studying whether it might be possible to reconstruct the nervous system, a challenge given the boggling complexity in even the simplest animals. The humble fly brain that Scheffer studies has about 100 million connections. The success of Scheffer and his colleagues in mapping a small fraction of those connections, the region of the fly’s brain that processes vision, warranted a 2013 publication in Nature, likely the world’s most prestigious scientific journal.
Tuesday, January 26th, 2016
CC-100 PowerOp IP
The CC-100 PowerOp IP harvests waste energy (logic overlap current) in digital and mixed signal SOC’s, and recycles a portion of it back into the system for an overall lower system power profile. This IP allows users to save watts of power, depending on how much digital or dynamic power is being consumed in a given SOC, and can fit in the left-over “white space” of most SOC or processor designs.
In short, this IP turns the standard power saving techniques around, saving power when circuits turn on, thus complimenting, not competing with, standard industry techniques normally used to save power.
The CC-100 PowerOp IP has been realized in Proof-of-Concept silicon and has been produced and characterized on the IBM CM018RF RF manufacturing process.
The CC-100 PowerOp IP import is scalable to any IC process ranging from .6um to 28nm, available on request from CurrentRF Proof-of-concept, characterization, and design aid documents and boards for the CC-100 IP are also available on request.
Tuesday, January 26th, 2016
Most associate USB and it’s hardware as a digital and system data transfer protocol only. Thinking of USB in terms of Analog and RF has only recently been a subject of interest in USB design, a necessity with the advent of USB 3 speeds and protocols. In fact, RF effects become dominant in the data transfer speeds involved with in USB 3. CurrentRF has developed a methodologies and technologies that allow server and network device USB ports, normally thought as digital and system data transfer ports, to be used as Analog/RF pickup ports for system noise and power reduction.
If one opens and ignores the data lines used for any flavor of USB, and focuses only on the resident +5V power and ground lines, one will see a rich source of RF frequencies of significant magnitude, that would enable energy harvesting techniques to be employed to recover this resident, generated energy. In fact, if one utilizes an ac coupled spectrum analyzer of sufficient bandwidth, one will not only see frequency spikes and noise related to USB data transfers, but “coupled in” frequencies and noise energies related to other aspects of servers and network devices.
Wednesday, May 27th, 2015
Emulation is enjoying its moment in the spotlight and none too soon. Design complexity of all types has conspired to make chip verification an arduous task. These days, the fabric of system-on-chip (SoC) designs includes several processing cores, large sets of specialized IP, a plethora of peripherals and complex memories, routinely pushing the design size into the hundreds of million gates. Embedded software now exceeds the complexity of the hardware.
Consider that for each hardware designer there are at least five software developers. No surprise that chip verification and validation has become an overriding concern for all project teams, particularly when hardware and software integration is concerned. Here is where the rubber meets the road, and where the verification challenges reach their peak.
Wednesday, March 4th, 2015
DesignCon, held at the Santa Clara Convention Center, is one of the biggest annual conference on product technologies, design methodologies, and EDA software, with a focus on system-on-chip design.
Wednesday, December 10th, 2014
No matter where you are in the global electronics supply chain, you’ve probably heard the phrase, “I need it now.” In this fast-moving, ever-evolving industry, we hear that a lot.
What drives what happens now? A critical combination of the latest technology and knowledge, which is what you’ll find at IPC APEX EXPO 2015.
Tuesday, November 4th, 2014
Initially, USB provided two speeds (12 Mbps and 1.5 Mbps). With rapid adoption and success of the USB standard and the increasing power of PCs and computing devices, the USB 2.0 specification was defined in the year 2000. USB 2.0 provided upto 480 Mbps of bandwidth while keeping software compatibility with earlier USB applications. With ever increasing bandwidth requirements, in 2008 the USB 3.0 specification (providing 5 Gbps bi-directional bandwidth) was released. USB 3.1 is the next logical step in this progression. It provides 10Gbps of bi-directional bandwidth while maintaining backward compatibility with previous USB versions. To know more about USB 3.1 Verification solution click here.
In this post, we will analyze the technical differences between the USB 3.1 and USB 3.0 specifications. The aim is to enable people familiar with USB 3.0 to quickly understand the main aspects of USB 3.1.
We will analyze the PHY, Link and Protocol layers and list out the major ways in which USB 3.1 differs from USB 3.0.