DAC looms!
If you do nothing else on Wednesday, June 6th, at the Design Automation Conference be sure to attend the second of the two keynotes.
Intel’s Brad Heaney will be talking about “designing a 22nm Intel Architecture Multi-CPU and CPU.” It’s got well over a billion transistors and would have only been the stuff of Sci-Fi dreams a brief 15 or 20 years ago.
After that, just like on Terrible Tuesday, you’ve got a wicked wheelbarrow full of different ways you could go, starting with the User Track. The Wednesday line-up in this well-received recent addition to the DAC schedule includes:
* Packaging & Automatic P&R, with speakers from Mentor Graphics, Samsung, and Intel
* Keynoter Q&A, with the morning’s IBM & Intel speakers fielding questions from the crowd
* Practical Formal Methods, with speakers from IBM, Oski, and Intel
If your interests, however, reside with the young more than the mega-organizations in the EDA ecosystem, Wednesday is your day to visit the ACM Sigda University Booth in the Exhibition Hall, where the “new EDA tools, EDA tools applications, design projects, and instructional materials” will be your guide to the future minds of this industry.
