Posts Tagged ‘multi-threaded’
Thursday, September 1st, 2016
For those unfamiliar with the idiom, “hitting the town” or “going out on the town” means heading out to make the rounds of bars, restaurants, theaters, clubs, etc. It’s usually used in a city where such entertainment options abound. The topic of today’s post on The Breker Trekker blog is a particular club, DVClub, that packs in plenty of solid technical information along with entertainment. You may not have to go far to hit one; a DVClub event is likely to be coming to your city soon.
The history of the Design Verification Club (DVClub) is quite interesting, stretching back more than ten years. It started as an informal event for verification engineers to get together to share stories and talk about new technologies to help them do their jobs. You might have noticed that, unlike DVCon, the title means “design verification” and not “design and verification.” This gathering is intended for semiconductor functional verification engineers.
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Tags: acceleration, apps, Breker, cache coherency, coverage, debug, DVClub, EDA, functional verification, graph, horizontal reuse, multi-SoC, multi-threaded, multiprocessor, Obsidian, Paradigm Works, portable stimulus, scenario model, SoC verification, system coverage, transactional, TVS, uvm, vertical reuse
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Wednesday, August 24th, 2016
Three weeks ago, we published a post on The Breker Trekker blog that previewed some of the talks and tutorials on the technical program at the upcoming third Design and Verification Conference and Exhibition (DVCon) India on September 15-16 in Bangalore. More of the details on the conference are now available online, and for today we’d like to highlight some of the keynote addresses, panels, and poster sessions on the agenda that also stand out for us.
As always, the program and steering committees have put a lot of thought into keynote speakers who will take a wide view of not just the EDA industry, but the larger electronics industry that we serve. Mentor CEO Wally Rhines is always a great speaker who comes armed with lots of charts and statistics to support his positions. His talk on “Design Verification: Challenging Yesterday, Today and Tomorrow” will survey the history and evolution of verification while predicting some of the future challenges
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Tags: acceleration, Accellera, Breker, Broadcom, Cadence, coverage, debug, dvcon, DVCon India, EDA, emulation, FPGA prototyping, functional verification, graph, graph-based, Infineon, Intel, mentor, multi-SoC, multi-threaded, multiprocessor, NXP, portable stimulus, PSWG, Qualcomm, reuse, scenario model, simulation, SoC verification, software-driven verification, Synopsys, test generator, transactional, TVS, Universal Verification Methodology, UVC, uvm, VIP
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Thursday, August 18th, 2016
When we first began offering our Trek family of products for what’s now known as portable stimulus, we talked a lot about vertical and horizontal reuse. Vertical reuse means that you can create a scenario model for individual IP blocks and generate test cases to run in their UVM testbenches, then move up to clusters and subsystems. The IP models can simply be plugged together to form a higher-level model from which appropriate higher-level test cases can be generated.
At the full-SoC level, you can generate C test cases that run on your embedded processors. Horizontal reuse is the ability to move from simulation to hardware (acceleration/emulation, FPGA prototypes, and silicon) while generating appropriate tests for these platforms from the same SoC scenario model. We generally described both forms of reuse in a unidirectional flow. However, bidirectionality is very valuable and, we believe, essential for portable stimulus. Let’s cover that topic in today’s blog post.
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Tags: acceleration, applications, apps, bidirectional, Breker, cache coherency, coverage, debug, EDA, emulation, FPGA prototyping, functional verification, graph, horizontal reuse, multi-SoC, multi-threaded, multiprocessor, portable stimulus, scenario model, simulation, SoC verification, system coverage, transactional, TrekApp, TrekBox, TrekSoC, TrekSoC-Si, uvm, vertical reuse
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Wednesday, August 3rd, 2016
As many of you know, in 2014 the longstanding Design and Verification Conference and Exhibition (DVCon) expanded beyond Silicon Valley to India. The first year of DVCon India was very successful for a new event, drawing more than 450 attendees from more than 80 companies and universities. Last year’s show grew to more than 600 engineers attending the technical program, visiting the vendor exhibition, and enjoying the numerous opportunities to network with their peers.
The third annual DVCon India will be held on September 15 and 16, once again at the Leela Palace in Bangalore. From our perspective, the show just keeps getting better and better every year. The full program is now available online, and for today’s post we’d like to mention some of the technical sessions that we think look especially interesting. In a future post, we’ll discuss other aspects of the program, including the keynote addresses.
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Tags: acceleration, Accellera, Breker, coverage, debug, dvcon, DVCon India, EDA, emulation, FPGA prototyping, functional verification, graph, graph-based, Infineon, IP-XACT, multi-SoC, multi-threaded, multiprocessor, NXP, performance analysis, portable stimulus, PSWG, reuse, scenario model, simulation, SoC verification, software-driven verification, test generator, transactional, Universal Verification Methodology, UPF3.0, UVC, uvm, VIP
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Wednesday, July 20th, 2016
Few recent announcements in the EDA, IP, or semiconductor industries have had the impact of SoftBank’s proposed US$32B acquisition of ARM. Many commentators have weighed in on this news. Today’s guest blogger, OneSpin Solutions Vice President of Marketing David Kelf, shares some thoughts on how changes to the ARM universe might intersect with ongoing changes in the open source community:
One side effect of the ARM acquisition news was an increase in the debate on the fascinating RISC-V Open Source processor development. Clearly this has the interest of a number of significant ARM users, judging by the recent workshop at MIT last week as one example, and might represent a significant game changer. It also begs the question on the application of Open Source, and indeed standardization efforts in general, in verification and how programs in this area might change the dynamics of increasingly closed environments from the two largest EDA vendors. (more…)
Tags: applications, apps, ARM, bandwidth, Breker, coverage, debug, EDA, emulation, formal, functional verification, graph, multi-threaded, multiprocessor, OneSpin, open source, portable stimulus, reuse, RISC-V, simulation, SoC verification, SystemC
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Thursday, July 14th, 2016
Recently, SemiconductorEngineering published the three–part series “System-Level Verification Tackles New Role” as part of its ongoing “Experts at the Table” discussions. The format is simple–an editor sits down with four or five industry experts to discuss a particular topic–but the debate can be lively and the result educational. Breker participates in these roundtables as often as we can, focusing of course on verification among the many technical topics covered by the site.
In advertising a “new role” for system-level verification, this particular series was not overstating the case. We tend to talk a lot about the evolution of verification in general, especially for system-on-chip (SoC) devices and multi-SoC systems. But in some ways what is happening now with our products and the Accellera portable stimulus standardization effort is more revolutionary than evolutionary. So which is it? We’ll attempt to answer that question in today’s post here on The Breker Trekker blog.
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Tags: acceleration, applications, apps, bandwidth, Breker, cache coherency, Cadence, coverage, debug, EDA, emulation, FPGA prototyping, functional verification, graph, Imperas, mentor, multi-SoC, multi-threaded, multiprocessor, performance analysis, portable stimulus, reuse, scenario model, simulation, SoC verification, system coverage, transactional, TrekApp, TrekBox, TrekSoC, TrekSoC-Si, UVC, uvm
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