Arm’s Initial Public Offering is proving successful: share price increased almost 25% soon after the company’s Nasdaq listing, which translates into a $65 billion valuation. More themes this week include memory tiering in the datacenters and a new way to use AI in chip design.
AI-enhanced, cloud-based PCB design
The AI-in-EDA trend extends to PCB tools. The new Cadence OrCAD X Platform promises up to 5X faster PCB design thanks to generative AI automation to reduce placement time, and by leveraging Cadence OnCloud integration. According to Cadence, the solution is optimized for small and medium businesses, offering a new, easy-to-learn and easy-to-use PCB layout canvas.
New MLPerf benchmarks
MLPerf Inference v3.1 introduces two new benchmarks to the suite. The first is a large language model (LLM) using the GPT-J reference model to summarize CNN news articles. The second is an updated recommender, modified to be more representative of industry practices, using the DLRM-DCNv2 reference model and a much larger dataset. The latest MLPerf results also include, for the first time, the MLPerf Storage benchmark, which measures the performance of storage systems in the context of ML training workloads.
