Bridging the Frontier Bob Smith, Executive Director
Bob Smith is Executive Director of the ESD Alliance responsible for its management and operations. Previously, Bob was senior vice president of Marketing and Business Development at Uniquify, responsible for brand development, positioning, strategy and business development activities. Bob began his … More » ESD Alliance Welcomes Aselta Nanographics and Metis Microsystems to its Growing CommunityOctober 7th, 2021 by Bob Smith, Executive Director
I’m pleased to welcome Aselta Nanographics and Metis Microsystems to the ESD Alliance community. Both have countless reasons for joining. For example, Yorick Trouiller, Aselta Nanographics’ CEO, noted: “Joining the ESD Alliance is a great opportunity to stay connected with the EDA community and take an active part in the discussions driving the future of semiconductor manufacturing.” According to Azeez Bhavnagarwala, founder of Metis Microsystems, “As a startup dedicated to enabling energy efficiency in semiconductor products, we are excited about the opportunities the ESD Alliance and SEMI offer to connect with the network of industry members. Both the ESD Alliance and SEMI have initiatives and resources offered by their domain-specific Smart Initiatives, Technology Communities and Committees that can help us understand and engage with industry members as a startup on topics of common interest.” Aselta Nanographics of Grenoble, France, provides advanced software solutions for wafer and mask patterning based on e-beam technology. It develops software tools to improve the quality process of chip production and operates in the IC manufacturing world providing advanced software solutions for wafer and mask patterning based on e-beam technology as well as solutions for contour-based metrology. Aselta Nanographics is a spin-off of CEA-Leti and maintains strong links with cutting-edge fundamental research and applies it to deliver advanced industrial solutions to customers in the U.S., Europe and Asia.
Metis Microsystems, founded in 2017, develops advanced energy-efficient Memory and Arithmetic/Logic IP for CMOS applications ranging from energy-starved intelligent devices at the edge to networking hardware and accelerators in the data center. It provides advanced memory and floating point arithmetic IP. The IP improves CMOS energy efficiency in AI accelerators, networking and wireless hardware using methods and circuits to harvest on-chip transient data as an energy source with a focus on CIM, SRAM, Register File and CAM arrays. In addition to their ESD Alliance membership, both are members of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain. If your company isn’t a member of the ESD Alliance or SEMI, isn’t it time to consider joining? The ESD Alliance, a SEMI Technology Community, hosts an array of programs, initiatives and events. For more details, visit the ESD Alliance website. Or contact me at bsmith@semi.org. Engage with the ESD Alliance at: Website: www.esd-alliance.org ESD Alliance Bridging the Frontier blog Twitter: @ESDAlliance |