Posts Tagged ‘publishing’
Thursday, February 9th, 2012
To finish off our series of predictions, I would like to point you to another series of interesting and informative prophesies. Click on the following topics to see these predictions collected by Brian Bailey, Editor of EDA DesignLine.
Industry Trends
Tools
ESL
IP and Physical Design
The Bold Prediction for EDA
A big THANK YOU from Ed & me (Liz) to all who shared their eye opening predictions with us. Click on their names to see their predictions. Mike Gianfagna, Karen Bartleson, Paul McLellan, Jens Andersen, Bob Smith, Steve Schulz, Mathias Silvant, Herb Reiter, Max Maxfield, Chris Edwards, John Barr.
Only time will tell……
 The Persistence of Memory, 1931, Salvador Dali
Tags: 2.5D, 2012, 3D, 3D stacked die, Ansys, Atrenta, Cadence, Dassault, Double Patterning, EDA, EDA & IP, eda 2 asic Consulting, EDA DesignLine, EDA360, EdXact, Electronic Design Automation, Engineering & Technology, FPGA, Invarian, investment, IP, Lee PR, Lithography, low power, Low Power Design, Low-Power Design Blog, Magma, Maxfield High-Tech Consulting, Mentor, Needham, New Electronics, Programmable Logic, Programmable Logic DesignLine, publishing, Semi-wiki.com, Semiconductor IP, semiconductors, Si2, SoC, SoC Realization, social media, software, Standards, Synopsys, System on Chip, Tech Design Forum, textbooks, www.leepr.com
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Wednesday, January 25th, 2012
On the ASIC/SoC side of the fence: Reducing power consumption is becoming increasingly important — I anticipate that this is the year that power will finally come to the forefront of EDA tools — I know that they optimize for power now, but largely as a second thought — like synthesis, for example, optimizes first for area and timing and then for power — I think we’ll see a move to optimize for power as a primary consideration.
On the FPGA side of the fence: As we move to the 28nm node and below, radiation is increasingly of concern with regard to electronic devices. It’s no longer just of interest for aerospace applications — at these low device geometries, radiation can affect chips in terrestrial applications. FPGAs are particularly susceptible because in addition to their normal logic and registers and memory cells they also have configuration cells. In the past, the only radiation-tolerant FPGAs were antifuse based — but these are only one-time-programmable (OTP) and trail the leading edge technology node by one or two generations. SRAM-based FPGAs offer many advantages in terms of reconfigurability and being at the leading edge of technology, but they are more susceptible to radiation events in their configuration cells. My prediction is that we will see more and more efforts from FPGA chip vendors and EDA tool vendors with regard to creating radiation-tolerant designs.
On the personal side of the fence: I predict that people will come to realize that what the world needs is a book about creating radiation-tolerant electronic designs that can be read and understood by folks who DO NOT have a PhD in nuclear physics — a book that is of interest to the people who design silicon chips (both analog and digital), the people who create EDA tools, the companies who manufacture the chips, and even software engineers (have you heard of “radiation tolerant software”?). I further predict that someone will finally realize that I am the best person to write this book and will approach me with a really great sponsorship deal that will bring tears of delight to my eyes 🙂
Clive “Max” Maxfield
Maxfield High-Tech Consulting
Editor, Programmable Logic DesignLine, EE Times
www.CliveMaxfield.com
Tags: 2012, ASIC, EDA, EDA & IP, EE Times, Electronic Design Automation, FPGA, Lee PR, low power, Maxfield High-Tech Consulting, Programmable Logic, Programmable Logic DesignLine, publishing, semiconductors, SoC, software, SRAM, System on Chip, textbooks, www.leepr.com
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