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 Agnisys Automation Review

Archive for March, 2020

Automating Design Assembly

Tuesday, March 3rd, 2020

The consumer revolution over the past few decades has funneled a growth of SoC chips primarily in the area of consumer electronics. This revolution along with the increase of automotive and industrial electronics has led to a trend in convergence of applications on a single device. Companies vying for a bigger share of the market place are enticing their consumers by offering new or better features, which often adds to design complexities. In this competitive food chain, chip design companies are tragetting the companies developing these consumer devices with a range of functionalities embedded in single chip solutions. This convergence in applications as well as the growth of new technologies such as IoT, augmented reality, AI etc. has resulted in increasing demands on design complexity and design performance.  With an increase in design complexity and a reduction in time to market, chip designers are now grappling with ways to meet the performance requirements while at the same time reduce the design cycle.

Consequently, design teams are increasingly compelled to look at methodology changes that can help accelerate chip assembly through one or multiple forms of automation.


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