Your Invitation to Verification 3.0 Innovation Summit

Come one, come all to the first event of what we expect will be many –– Verification 3.0 Innovation Summit –– Tuesday, March 19, from 1 p.m. until 8 p.m. at the Levi’s Stadium Team Auditorium in Santa Clara, Calif.

Meant for all of you in the chip design verification community, the event will provide advanced technical content focused on semiconductor verification innovation. It will tackle topical subjects at a deep technical level and consider the latest thinking on critical verification methodology and technologies.

The start up and smaller verification companies are a source for a large proportion of verification innovation, but getting the word out on those innovations has become harder and harder. This new event represents a single opportunity to hear the latest from all of these companies in one shot.

All of your favorite chip design verification technology suppliers and a few you may not know are sponsors of the exclusive, half-day seminar. Gold Sponsors are Avery Design Systems, Agnisys, Breker Verification Systems, Concept Engineering, Imperas Software, Methodics, Metrics, OneSpin Solutions, T&VS, Vayavya Labs, Verifyter and Vtool. Silver Sponsors are Willamette HDL and XtremeEDA.

Three sessions will cover the verification landscape. The first, “Advanced Simulation, Emulation, Testbench and Verification IP,” will offer presentations from Avery, Breker, Metrics and TV&S.

Session two will feature Agnisys, Imperas, OneSpin and Vayavya covering “Hybrid, hardware/software and Formal.” Concept Engineering, Methodics, Vtool and Verifyter will address “Debug, Coverage, Verification Management.” For a complete program of the event, click here.

A highlight will be the keynote by Joe Costello, former CEO of Cadence. Any of you who attended Joe’s talks in the past know he is inspiring. His insights are memorable, as are his spot-on insights that predict markets and identify trends. Joe is becoming more involved with smaller verification companies and has a number of observations on the latest trends.

Special thanks goes to Jim Hogan, noted industry luminary, the primary event sponsor and a driver for Verification 3.0. Jim calls it a new plateau in the continuing evolution of semiconductor solutions, a balance in the combination of the various solutions that make up modern verification environments. According to Jim, Verification 3.0 has four foundational legs with multiple facets –– the continuum of verification engines, the intelligent testbench, the merging of hardware and software, and the expanding role of verification. Some may sound familiar and each is seeing significant transformation. You will have a chance to talk with Jim directly during the day to learn more.

The seminar will conclude with a mini exhibit area with sponsoring companies and reception in the Levi’s Stadium Black Oak Casino Club overlooking the Levi’s Stadium field will follow.

Verification 3.0 Innovation Summit will be an unforgettable event filled with technical information on semiconductor verification innovation! We hope you will join us. While everyone is the chip design verification community is invited and the seminar and reception are free of charge, registration is limited to 126 attendees. If you plan to attend, please register today at: http://verification30.com/

Tags: Advanced Emulation, Advanced Simulation, Advanced Testbench, Advanced Verification IP, Breker, Jim Hogan, Joe Costello, Levi's Stadium, portable stimulus, Verification Innovation Summit, Verification3.0

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