Tezzaron Founder and CTO Bob Patti delivered a rousing keynote at the Silicon Valley Magma User Group meeting back in 2010, talking about his company’s 3D memory technology and how it offered a solution to the increased demands for on-chip capacity. I spoke to Patti following that speech, with details of the conversation posted here.
In the past 3 years, things have only gotten worse with respect to memory demands, so one might think Tezzaron’s solution is in even greater demand today. The problem, of course, is that Tezzaron Semiconductor is not the only company offering something that looks like ‘3D memory.’
In fact, 3 weeks ago at MemCon 2013 in Silicon Valley, I attended a keynote given by Micron Technology’s Mike Black singing the praises of his company’s Hybrid Memory Cube. Sitting in the audience, I tried to compare and contrast the Micron technology with what I believed to be the Tezzaron solution.
Happily, Tezzaron had a booth at MemCon, so it was possible to talk to somebody from the company about how they viewed Micron’s competing technology. Unfortunately, Tezzaron VP David Chapman was surrounded by a mob of interested people when I got to the booth, so I took his card and arranged to talk to him later about my many questions.
My number one question: Given the size of Micron and the ecosystem of partners they’ve assembled, the Hybrid Memory Cube Consortium, is Tezzaron winning the battle of technology superiority, but losing the war for market share?
Tezzaron’s Chapman was not offended by my question. Instead, he started by framing his answer with a description of current market needs and continued from there. The following is a transcript of his comments.
