At the IEEE International Electron Devices Meeting (IEDM) 2024, Intel Foundry unveiled a series of pioneering advancements poised to reshape the semiconductor landscape for the coming decade. With innovations addressing transistor scaling, interconnect efficiency, and advanced packaging, Intel’s research highlights the company’s leadership in enabling the exponential growth of computing power required to meet artificial intelligence’s (AI) insatiable demands.
As AI continues to push the limits of existing technology, the need for energy-efficient, high-performance chips grows ever more critical. Intel’s latest breakthroughs mark significant steps in transistor miniaturization, interconnect materials, and assembly techniques—key ingredients for sustaining Moore’s Law and advancing toward a trillion-transistor chip by 2030.
“Our research at Intel Foundry is focused on overcoming the technological roadblocks of tomorrow,” said Sanjay Natarajan, Intel senior vice president and general manager of Intel Foundry Technology Research. “These advancements reflect our mission to deliver cutting-edge semiconductor innovations, developed domestically, to meet global AI demands and solidify U.S. manufacturing leadership under initiatives like the CHIPS Act.”
