Guest Blogger Sanjay Gangal
Sanjay Gangal is a veteran of Electronics Design industry with over 25 years experience. He has previously worked at Mentor Graphics, Meta Software and Sun Microsystems. He has been contributing to EDACafe since 1999. EDACafe Industry Predictions for 2023 – KDPOFJanuary 5th, 2023 by Sanjay Gangal
By Carlos Pardo CEO and Co-founder of KDPOF What’s the outlook for multi-gigabit networking in vehicles? The year 2023 will lay the foundation for optical in-vehicle data communications with the IEEE Standards Association’s publication of the IEEE 802.3 automotive optical multi-gigabit standard, announced for early 2023. The proposed IEEE 802.3 automotive optical multi-gigabit standard draft specifies 2.5GBASE-AU, 5GBASE-AU, 10GBASE-AU, 25GBASE-AU, and 50GBASE-AU using bend-insensitive OM3 glass fiber. The OM3 class has been chosen because it’s already extensively used in data centers with applications in more stressful applications like avionics. The draft standard optical specifications will allow the use of reliable light sources based on proven technology. Cameras, displays, and sensors located throughout a vehicle typically connect to various electronic control units. These control units optimize operation of the vehicle power train or provide the navigation and entertainment features included in vehicles and have been included as test cases for standardization. The multi-gigabit capabilities the draft standard specifies will also be critical for the continued evolution of driver-assist and ultimately autonomous vehicle operation. The first prototypes for proof of concept will be available in the third quarter 2023.
In order to fulfill the needs of future connected and automated vehicles, the trend towards system solutions instead of various port components will proceed further. Accordingly, we’re working on an optical automotive multi-gigabit system that provides a single, complete package. The new connector systems are very small, lightweight, and extremely inexpensive compared to the previous ones. The technology in development is based on advanced digital signal processing, using high-speed DAC and ADC to implement all needed algorithms such as equalization or pre-coding. Higher speeds (25, 50, … 100 Gb/s) as well as the integration of optical links with cameras, radars, and displays are targeted. The lack of supply in the semiconductor industry will remain a major challenge. Manufacturing plants within Europe are without alternatives. KDPOF is setting up a fully automated production facility in Europe for all our products to guarantee the continuity of supply at low prices. For the future beyond 2023, I see four major trends: replacement of CAN-fd by Ethernet 10 Mb/s in the lower speeds, the adoption of secure standards like MACSEC or IPSEC, the inclusion of cameras, radar and display in the network, and the exponential increase of backbone speeds. For the last three items, optical communications enable robust, reliable, secure, low-cost, and out-performing solutions. In the not too distant future, I can see cars with incredible technologies, all of them supported by very high speed optical networks, as we can see many facilities integrated into modern cars in 2023, like personalization, changing the car’s colors with one click, smart screens, full HD displays, more sensors and HD cameras integrated. About KDPOF Fabless semiconductor supplier KDPOF provides innovative high-speed optical networking for harsh environments. KDPOF made gigabit communications overstep-index plastic optical fiber (SI-POF) a reality for automotive. Founded in 2010 in Madrid, Spain, KDPOF offers its cost-effective technology as a fully qualified automotive-grade ASSP. KDPOF’s technology makes use of innovative digital adaptive algorithms to maximize the receiver’s sensitivity. This supports high-yield and reliable optoelectronics production in low-cost bulk CMOS deep submicron nodes, delivering carmakers low risk, low cost, and short time-to-market. More information is available at https://www.kdpof.com Carlos Pardo is CEO and Co-founder of KDPOF. He has served as a strategic profile manager in the microelectronics industry and with leading R&D teams. He has extensive knowledge in the high-tech silicon industry, as well as in both hardware and software development. Carlos holds a degree in Industrial Engineering from the University Pontificia de Comillas of Madrid, (Spain) with an Industrial Engineering ICAI specialization in industrial electronics. He previously worked as a technical director in SIDSA managing R&D departments, development products, production, and customer support, among others. Carlos was also part of Hewlett Packard SA Spanish as an R&D engineer for a variety of other business functions and DS2 (Design of Systems on Silicon SA). In 2010, Carlos Pardo, together with Rubén Pérez de Aranda, raised money and founded KDPOF in Madrid to redirect their focus towards advancing optical fiber communications. Carlos and Rubén quickly built an engineering team with their SIDSA connections. Category: EDA Predictions |