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Archive for May 9th, 2024

Synopsys to sell Software Integrity Group; Micron to get CHIPS Act funding; 3D solution for RFSOI; recyclable PCBs

Thursday, May 9th, 2024

An interesting side effect of the so-called “chip war” is that, now, even large news agencies are sometimes delving quite deep into technology topics. News agency Reuters has recently assigned reverse engineering experts to tear down a Huawei phone, to find out who made the chips inside it. The two companies that performed the analysis – iFixit and TechSearch International – found that Huawei’s Pura 70 Pro contains more China-made parts than previous models, highlighting the progress China is making towards technology self-sufficiency. Chinese components found in the high-end phone include a NAND memory that was likely packaged by Huawei’s in-house chip unit HiSilicon, and a Kirin 9010 processor that is likely a slightly improved version of the chip used by Huawei’s Mate 60 series.

Synopsys to sell its Software Integrity Group

After its recent Ansys acquisition, Synopsys is now focusing on EDA by selling its non-EDA division. The company has entered into a definitive agreement with Clearlake Capital Group and Francisco Partners, two global private equity firms, for the sale of its Software Integrity Group business in a transaction with a total value of up to $2.1 billion. Upon completion of the transaction, the business will emerge as a newly independent application security testing software provider. The existing Software Integrity Group management team is expected to lead the new privately held company, whose name has not been announced yet.

Micron to get $6.1 billion CHIPS Act funding

Micron Technology and the Biden-Harris Administration have signed a non-binding Preliminary Memorandum of Terms (PMT) for $6.1 billion in funding under the U.S. CHIPS and Science Act to support planned leading-edge memory manufacturing in Idaho and New York. Construction of the new Boise fab – which will be co-located with Micron’s R&D center – started in October 2023. The Idaho fab is expected to come online and be operational in 2025, with DRAM output starting in 2026. In New York, preliminary design, field studies and permitting applications are underway for the project; construction is expected to begin in 2025, with output starting in 2028.

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