The Phil Kaufman Award Ceremony and Banquet Coming in November to Hayes Mansion

Please join co-hosts the ESD Alliance and IEEE Council on Electronic Design Automation (CEDA) for a night of networking, celebrating and dining as we honor Dr. Jason Cong from UCLA, our 2024 Phil Kaufman Award recipient.

Dr. Jason Cong of UCLA, the 2024 Phil Kaufman Award recipient

The Phil Kaufman Award Ceremony and Banquet will be held Wednesday, November 6, from 6:30 until 9:30pm at a new location –– Hayes Mansion in San Jose. Register today to secure early-bird pricing that ends Friday, September 27. Early-bird pricing for members is $275 and $325 for non-members. Regular pricing jumps to $300 for members and $350 for non-members. Member pricing is offered for individuals or companies that are active SEMI or IEEE members.

Registration is found on the ESD Alliance website. Corporate sponsorship opportunities are available. Contact me at bsmith@semi.org for more information.

Serving as emcee for the evening is Ed Sperling, Editor in Chief of Semiconductor Engineering. The tribute presenters are Dr. David Z. Pan from the University of Texas at Austin and Rob Rutenbar of the University of Pittsburgh and the 2017 Phil Kaufman Award Recipient.

Acknowledging Dr. Jason Cong

Dr. Cong is widely recognized for his contributions to FPGA design automation technology and electronic system design education from circuit to system levels with widespread industrial impact. He serves as the Volgenau Chair for Engineering Excellence Professor at the UCLA Computer Science Department, and is a former department chair, with a joint appointment from the Electrical and Computer Engineering Department. He is the director of the Center for Domain-Specific Computing (CDSC) and director of the VLSI Architecture, Synthesis and Technology (VAST) Laboratory. Dr. Cong’s research interests include novel architectures and compilation for customizable computing, synthesis of VLSI circuits and systems and quantum computing.

About the ESD Alliance

The Phil Kaufman Award is just one of the many programs the ESD Alliance, a SEMI Technology Community, offers our members. Our initiatives and activities that bring value to our entire industry include:

• Coordinating and amplifying the collective and regional voices of our industry.
• Continually promoting the value our industry delivers to the global semiconductor and electronics industry.
• Addressing and defending threats and reducing risks to our industry.
• Achieving efficiencies for our industry.
• Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
• Enabling networking, sharing and collaboration across our industry.

If your company is not currently a member, shouldn’t it consider joining us?

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This entry was posted on Monday, September 16th, 2024 at 10:57 am. You can follow any responses to this entry through the RSS 2.0 feed. You can leave a response, or trackback from your own site.