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Archive for March 13th, 2023

An Epic Chiplet Evolution

Monday, March 13th, 2023

 

Chiplet evolution

Note: I recently talked with Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit, about the growing use of chiplets. He has a unique perspective that’s captured below in a blog post I wrote for 3D InCites.

 

Jean-Marie Brunet, Vice President and General Manager of the Siemens Hardware-Assisted Verification business unit finds himself and his group in a unique situation when it comes to the topic of chiplets. The group designs a chiplet for their own products and sells those products to verification engineers who are verifying chiplet designs.

I recently had a conversation with Jean-Marie to get his perspective on chiplets and why he believes they are leading an epic chiplet evolution.

Smith: A significant challenge to chiplet adoption is scaling. Is that the biggest challenge or are there more pressing challenges?

Brunet: It’s a big topic. First, let me explain why. I manage an organization that develop hardware verification technology to the market –– emulators and FPGA prototyping hardware.

In the case of the emulator, we create all parts of the emulator. We build a very large device with a complex hardware architecture that must run a large amount of software. By developing our own hardware, we understand scaling challenges.

In terms of scaling, there is a lot of talk about how Moore’s Law is dead. No, Moore’s Law is doing just fine. Today semiconductor companies are designing for two or three nanometer process technology that uses a different type of transistor so it’s very expensive to go to an advanced node.
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