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 Bridging the Frontier
Bob Smith, Executive Director
Bob Smith, Executive Director
Bob Smith is Executive Director of the ESD Alliance responsible for its management and operations. Previously, Bob was senior vice president of Marketing and Business Development at Uniquify, responsible for brand development, positioning, strategy and business development activities. Bob began his … More »

The ESD Alliance’s Governing Council Chaired by Arm’s Simon Segars; Remote Work, Remote Chip Design: Building Chips in a Pandemic

 
May 26th, 2021 by Bob Smith, Executive Director

The ESD Alliance recently finished elections for our new slate of Governing Council members and I’m pleased to welcome back nine members along with newly elected member Aki Fujimura, D2S’ CEO. Our Governing Council Chair is Simon Segars, CEO of Arm, who has served in that role since 2019.

Returning Governing Council members who will serve a two-year term that runs through 2023:

As our new term gets under way, I commend the Governing Council for its accomplishments from the last term. With this kind of momentum, I expect we will accomplish even more the new term.

A big thank you to our member companies. The current slate of Governing Council members was elected by more than 90% of eligible members companies casting ballots during the voting period that ended May 14.

A Reminder: Remote Work, Remote Chip Design: Building Chips in a Pandemic

A reminder about the panel co-hosted by the ESD Alliance and Accellera that will focus on the challenges to remotely designing and building chips over the last year. Please plan to join us as we learn about the difficulties and successes our panelists faced Wednesday, June 9, from 9-10am PDT.

Tom Fitzpatrick, Strategic Verification Architect from Siemens EDA, will moderate the discussion with experienced engineers who had to quickly modify development practices. We’ll hear how they worked on innovations requiring intense collaboration and whether they were able to evaluate and implement new methodologies. Expect to discover how product schedules were impacted and issues resolved and get some sound advice on best practices.

Panelists:

  • Martin Barnasconi, Technical Director System Design & Verification Methodologies, NXP
  • Lu Dai, Senior Director of Engineering, Qualcomm
  • Ashish Darbari, CEO, Axiomise
  • Mark Glasser, Member of the Technical Staff, Cerebras
  • Patrick Lynch, Senior Engineering Manager, Xilinx

The virtual format will include time for audience questions.

Date: Wednesday, June 9

Time: 9-10am PDT

Pricing: Complimentary

Registration:  https://bit.ly/3eK3YdQ

To learn more about the ESD Alliance, a SEMI Technology Community, and its programs, initiatives and upcoming events, visit the ESD Alliance website. Or contact me at bsmith@semi.org.

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