Posts Tagged ‘Ford’
Wednesday, April 27th, 2016
Last year at DAC in San Francisco, Synopsys’ Patrick Groeneveld and TUM Create’s Sebastian Steinhorst gave an afternoon tutorial addressing the energy equations around the current spate of electric vehicles. One of the most information-packed sessions I’ve ever attended at DAC, it reflected an enormous amount of work on the part of the two presenters.
Now here in April 2016, rumor and information in the press about EVs is really on the upswing. Apple is developing an EV in various top-secret locations scattered about Silicon Valley, a rumor supported by the company hiring Tesla’s VP of Vehicle Engineering Chris Porritt. Tesla has its own dramatic announcement: As of mid-April, they’ve received upwards of 400,000 pre-production orders for their new $35,000 Model 3 sedan.
My recent phone call with Patrick Groeneveld was an opportunity to further understand the current EV landscape: We began with the Tesla news.
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Tags: Apple, BMW, Chevy, Electric Vehicles, Elon Musk, EV, Ford, GM, GM Korea, Mercedes, Model 3, NUMMI, Patrick Groeneveld, Sebastian Steinhorst, Steve Wozniak, Tesla, Toyota, VW 1 Comment »
Thursday, March 24th, 2016
To speak with Herb Reiter about the rationale for multi-die packaging is a chance to follow a logical and energetic continuum from first principles to a final conclusion. Namely, that as the era of the ASIC subsides, the era of the multi-die package will arrive full force.
Reiter, President of eda 2 asic, will be reiterating this line of thinking, in conjunction with a panel of like-minded experts, at the upcoming EDPS conference in Monterey on April 21st. In anticipation of that session – “Multi-Die IC Design and Application” – we spoke by phone this week. The conversation was compelling.
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Tags: Asim Salim, autonomous driving, Cliff Hou, Dusan Petranovic, eda 2 asic, EDPS, Ford, Gary Smith, Google, Herb Reiter, ITRS, Ivor Barber, Multi-die packaging, Paul Silvestri, Riko Radojcic, TSMC 1 Comment »
Thursday, July 17th, 2014
Once again EDAC’s Market Statistics Service has released quarterly results for the EDA and IP industries, and once again Mentor Graphics CEO Wally Rhines has taken time to debrief the press on the numbers. When we spoke by phone on July 15th, Rhines started with a qualitative eval of the financial situation in Q1_2014, and moved from there to answer several longer-range questions about autos and today’s troubled world.
“The first quarter of 2014 was good for the industry, but not great,” he said. “With overall growth of 4.6 percent, year over year, it was a good quarter with the highlight being logic design was up a solid 6.6 percent. Other than that, there was not a lot else [remarkable in EDA].”
“Steady, but not glamorous, for Q1?” I asked.
Rhines said, “Yes, steady as she goes in EDA. The IP business, however, was up strongly in Q1, driven up by results from the non-reporting companies, not members of EDAC. We collect public info from non-reporting IP companies such as ARM, Imagination Technologies, MIPS, Rambus [and Synopsys], and we can see overall that the IP business [exhibited] 10-percent growth, quarter over quarter, Q1_2013 to Q1_2014.”
He added, “The bigger trend [visible in] the current MSS report is that all of the world is showing strong [sales], except Japan which is very weak, down 19 percent in contrast to Asia Pacific, which is up 13.5 percent.
“You should also note that North America and Europe are quite strong, up 7 percent or more. Japan is well below those regions as well. Japan used to be a big part of the total [numbers for the industry], substantially larger than the Asia Pacific Region, but now the Pac Rim is twice the size of the Japanese market.”
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Tags: ARM, Cadence, DAC, EDAC, Egypt, El Salvador, Ford, Imagination Technologies, Infineon, Israel, James Buczkowski, MathWorks, Mentor Graphics, Microsoft, MIPS, MSS, Nokia, NXP, Pakistan, Rambus, Renesas Electronics, Synopsys, TI, Wally Rhines 2 Comments »
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