Siemens’ Next-Gen Electronic Systems Design Platform: A Unified Vision of AI, Collaboration, and Innovation

In a transformative leap for electronic systems design, Siemens Digital Industries Software has unveiled a next-generation platform that integrates its industry-leading tools—Xpedition™, Hyperlynx™, and PADS™ Professional. This groundbreaking release is more than a mere product update; it represents a holistic reimagining of the design process, aimed at solving critical challenges in a rapidly evolving industry.

I had the privilege of speaking with AJ Incorvaia, Senior Vice President of Electronic Board Systems at Siemens, who shared the philosophy and features driving this ambitious project. According to AJ, “This is the platform that we will be building on for years to come, combining the power of AI, seamless cloud connectivity, and a unified user experience to empower engineers and organizations.”

The electronics industry faces multiple hurdles: a wave of experienced engineers retiring, less experienced talent stepping in, growing design complexity, and supply chain instability. These factors demand tools that are intuitive yet powerful, fostering collaboration across increasingly globalized and multidisciplinary teams. To address these challenges, Siemens has unified its PCB design tools into a single cohesive platform. The new system not only integrates layout, schematic capture, and signal integrity analysis but also connects seamlessly with Siemens’ Teamcenter® for product lifecycle management and NX™ for mechanical engineering. This cross-domain collaboration ensures that electrical and mechanical engineers can work in harmony, solving a historically difficult problem of mismatched terminology and disconnected workflows.

One of the platform’s most compelling innovations is its AI-infused capabilities. The system learns an engineer’s design style, predicting their next steps and providing tailored command recommendations. For instance, in PCB routing, the AI engine suggests the optimal sequence of commands, streamlining a traditionally labor-intensive task. Additionally, the platform features a natural language support co-pilot, allowing users to ask questions like, “How do I complete XYZ operation?” and receive step-by-step guidance. AJ emphasized, “This isn’t about adding complexity; it’s about making the advanced capabilities of AI accessible to every engineer, whether they realize they’re using it or not.”

With cloud connectivity as a cornerstone, Siemens’ platform enables unparalleled collaboration across teams and geographies. Engineers can work on designs simultaneously, share specific elements with external collaborators, and even conduct offline tasks like signal integrity verification—all within a secure, role-based access environment. This feature is particularly valuable for projects involving third-party experts or global supply chain considerations. AJ highlighted an example: “Imagine inviting a third-party signal integrity expert to validate certain aspects of a design. You can share just the relevant data in a highly secure manner, ensuring seamless collaboration without compromising sensitive information.”

A major leap forward is the platform’s integration with Siemens’ Teamcenter and NX software. Historically, ECAD and MCAD teams have faced significant hurdles in unifying their workflows due to differing terminologies and data representations. Siemens’ solution bridges this gap, enabling true multi-domain collaboration. Teams can now create a single bill of materials (BOM) that supports all design elements, including complex variants, ensuring consistency across disciplines.

Siemens has reimagined the user experience with a focus on accessibility and ease of use. Built on Microsoft Fluent design principles, the interface will feel familiar to users of Microsoft Teams, offering a streamlined layout, embedded tutorials, and advanced search capabilities. “We’ve made it so that even occasional users can quickly find what they need,” said AJ, “and new users can harness the full power of the platform without an overwhelming learning curve.”

Looking ahead, Siemens plans to expand the platform’s capabilities further. AJ outlined a roadmap that includes more AI-driven features, enhanced security protocols, and increased performance to manage the growing size and complexity of electronic designs. The platform will also continue to extend its reach from design inception through manufacturing, building digital threads that maintain data integrity throughout the lifecycle. The integration of Supplyframe’s supply chain data into the platform is another key differentiator. Engineers can now access real-time information about component availability, pricing, and risks directly within their design tools, ensuring BOM accuracy and resilience in an uncertain supply chain landscape.

As the interview wound down, AJ shared his personal passions outside of work. A dedicated woodworker, he recently crafted a custom mahogany-topped dining cabinet and a cedar-lined chest, blending creativity with precision—a fitting metaphor for Siemens’ approach to engineering tools. He also finds time for skiing in winter and golf in summer, though he describes himself as a “weekend hacker” on the green.

Siemens’ next-generation platform is more than a technological advancement; it’s a strategic response to the shifting dynamics of the electronics industry. By unifying tools, embracing AI, and fostering collaboration, Siemens is setting a new standard for what’s possible in electronic systems design. For those eager to explore this transformative platform, visit the Siemens EDA website and discover how it’s redefining innovation in the electronics industry.

Tags: AI in PCB design, cloud collaboration, ECAD-MCAD integration, electronic systems design, PCB design tools, Siemens EDA

Category: Siemens

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