Archive for the ‘Siemens’ Category
Monday, February 24th, 2025
Author: Matthew Hogan
A shift-left strategy to tackle the complexities of power domain leakage in IC design
Managing leakage power is a critical challenge for IC designers, as it can profoundly impact a device’s power, performance, area (PPA) and overall reliability. Leakage can manifest in various ways, from analog gate leakage causing high current drain to digital gate leakage leading to power management and reliability issues. Even subtle circuit changes can introduce leakage problems that compromise the final product. Traditionally, designers have left verification of these leakage issues until later design stages, resulting in costly rework. However, a shift-left approach that integrates leakage and reliability analysis into the pre-layout phase can help identify and address potential problems early on. By leveraging advanced EDA tools that take a holistic view of the circuit, designers can get ahead of leakage challenges and ensure their ICs meet the highest standards of quality and reliability.
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Tuesday, February 4th, 2025
Today’s complex System-on-Chip (SoC) designs and high-performance solutions demand robust, high-speed interfaces that keep pace with evolving market needs. As adopting the PCI Express (PCIe) 6.0 standard gains momentum, design teams face new challenges in ensuring reliable, high-throughput communication for data centers, edge devices, automotive systems, and beyond. That’s where our new ICE PCIe 6.0 speed adapter steps in—providing the ultimate bridge between the Veloce Strato/Strato+ emulation platform and the real world.
Why PCIe 6.0 Matters
PCIe 6.0 represents a significant leap in throughput, doubling the data rate over PCIe 5.0 to 64 GT/s per lane. This breakthrough efficiency supports the exponential growth in data-intensive applications like:
- AI Acceleration and Machine Learning
- High-Performance Computing (HPC) and Data Center Workloads
- Ultra-Fast Storage (e.g., NVMe SSDs)
- Networking and Cloud Infrastructure
- Advanced Driver-Assistance Systems (ADAS) in automotive
As speeds increase, verification complexity skyrockets. Testing and validating PCIe 6.0 capabilities early in the development cycle is critical to avoid costly silicon re-spins and unexpected integration issues.
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Friday, December 20th, 2024
Almost as long as FPGAs have been around, they have been used to prototype ASICs, SoCs, and IPs. While initially, the only option for users was to build their own prototyping board, that quickly changed with many commercial prototyping boards becoming available from vendors large and small. Ever since, the large question for users has been, should I develop and build or buy my boards?
Now, consider the pros and cons of this “build vs. buy” debate. But before that, probably the first question to ask yourself is what do you want the FPGA-based prototype to do? Having that answer allows you to consider the right priorities and trade-offs inherent in the decision to build or not to build a board. Let’s assume you buy rather than build, which commercial solution should you purchase? Key questions to ask yourself here are:
- What is the primary use mode, HW (RTL) verification or SW validation?
- How many FPGAs per board/system are needed to handle my design (e.g. single vs. multi-FPGA)?
- How many boards will I need?
- What physical at-speed interfaces do I need?
- What is the minimum performance the FPGA board must run at?
- What is my budget?
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Monday, December 16th, 2024
In a transformative leap for electronic systems design, Siemens Digital Industries Software has unveiled a next-generation platform that integrates its industry-leading tools—Xpedition™, Hyperlynx™, and PADS™ Professional. This groundbreaking release is more than a mere product update; it represents a holistic reimagining of the design process, aimed at solving critical challenges in a rapidly evolving industry.
I had the privilege of speaking with AJ Incorvaia, Senior Vice President of Electronic Board Systems at Siemens, who shared the philosophy and features driving this ambitious project. According to AJ, “This is the platform that we will be building on for years to come, combining the power of AI, seamless cloud connectivity, and a unified user experience to empower engineers and organizations.”
The electronics industry faces multiple hurdles: a wave of experienced engineers retiring, less experienced talent stepping in, growing design complexity, and supply chain instability. These factors demand tools that are intuitive yet powerful, fostering collaboration across increasingly globalized and multidisciplinary teams. To address these challenges, Siemens has unified its PCB design tools into a single cohesive platform. The new system not only integrates layout, schematic capture, and signal integrity analysis but also connects seamlessly with Siemens’ Teamcenter® for product lifecycle management and NX™ for mechanical engineering. This cross-domain collaboration ensures that electrical and mechanical engineers can work in harmony, solving a historically difficult problem of mismatched terminology and disconnected workflows.
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Tags: AI in PCB design, cloud collaboration, ECAD-MCAD integration, electronic systems design, PCB design tools, Siemens EDA No Comments »
Friday, November 22nd, 2024
As integrated circuit (IC) designs continue to scale, the demand for efficient power management, optimized performance and reliable physical layout modification grows more critical. Meeting power, performance, and area (PPA) targets is essential for effective IC operation at advanced process nodes. However, design and verification engineers face challenges in addressing issues like IR drop and electromigration (EM) early in the design process without compromising PPA objectives.
This is where a shift-left approach to power grid optimization can make a significant difference. By making design-stage layout modifications, designers can proactively tackle power management issues, enhancing reliability and PPA metrics. This strategy not only benefits engineering teams but also delivers substantial business advantages by reducing rework, lowering costs and accelerating time to market.
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Tuesday, November 12th, 2024
Multi-FPGA partitioning has undergone significant advancements over the years, driven by the increasing complexity of digital systems and the need for efficient prototyping and verification. Today’s prototypes require dozens of the larger FPGAs available in the market; making an optimized and automated approach to FPGA partitioning essential.
Partitioning designs across multiple FPGAs was often done manually. Engineers would divide the design based on their experience and intuition, which was time-consuming and prone to errors. This method worked for simpler designs but became impractical as the complexity of systems grew.
As digital designs became more complex, automated partitioning tools were developed. These tools aimed to optimize the partitioning process by considering logic capacity and inter-FPGA communication.
Hierarchical partitioning divides the design into smaller, manageable blocks, and then partitions them further. This method improves the efficiency of the partitioning process and reduces execution time.
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Friday, October 4th, 2024
The semiconductor industry is witnessing an exciting breakthrough with the introduction of Veloce proFPGA CS, the first VP1902 FPGA-based software prototyping solution on the market. Beyond its remarkable architecture, modularity, scalability, and high performance, Veloce proFPGA CS sets itself apart by prioritizing the designers experience.
In this article, we explore Veloce proFPGA CS and its full visibility debug capabilities, driven by innovative and unique reconstruction algorithms. This functionality has redefined the way designers approach debugging. Additionally, we delve into the seamless integration of backdoor access for memories allowing quick experiments with different application scenarios.
In today’s era of rapidly advancing design complexity, traditional probe-based debugging methods are no longer sufficient. While probe-based debug may provide limited visibility to register signals, it lacks the granularity required for detailed analysis of all signals. This shortcoming hinders the ability to identify the root cause of bugs quickly and accurately.
And as designs become more intricate with hundreds of interconnected components, the need for a comprehensive view of the systems behavior has become critical. The innovative reconstruction algorithms offered by proFPGA CS enables visibility to the cause of bugs.
Unleashing Full Visibility:
With Veloce proFPGA CS and the VPS user software for compile and debug, full visibility becomes a reality. Veloce proFPGA CS empowers designers to examine every aspect of their designs, from signals and registers to memories and combinatorial logic. This level of visibility provides an unprecedented understanding of system behavior.

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Thursday, September 12th, 2024
As the semiconductor industry adds more functionality into smaller footprints, we are pushing the boundaries of traditional two-dimensional integrated circuit (2DIC) designs. The next phase in the growth of performance and functionality is building three-dimensional integrated circuits (3DICs). However, this new dimension introduces a host of challenges, the most significant of which is managing heat dissipation.
The allure and pitfalls of 3DICs
The advantages of stacked dies interconnected using vertical interconnect accesses (vias), to create a single, compact package include:
- Increased performance: By reducing the distance between components, signal propagation delays are minimized, leading to faster processing speeds.
- Enhanced functionality: Multiple functions can be integrated into a single package, enabling more complex and capable devices.
- Reduced power consumption: Shorter interconnects can result in lower power consumption compared to traditional 2D ICs.
To realize these benefits, designers first need to clear some key hurdles, including the significant challenge of managing heat dissipation (figure 1). Because 3DIC architectures are so compact, heat generated by the densely packed components can cause hot spots that affect performance and reliability.
 Figure 1. Illustration of a 3DIC with heat dissipation.
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Thursday, June 13th, 2024
A trend sweeping through chip design is changing the traditional markets for CPUs and GPUs. Along the way, it is accelerating the number of design starts for artificial intelligence (AI) and building chips known as custom accelerators.
The custom accelerator trend is driven by system companies becoming semiconductor companies not relying on other companies to build their chips. They do most of the chip design in house to control the ecosystem, roadmaps, and time to market, adopting a different perspective. A good example is Apple. It’s designing its own iPhone and Mac chips now and they are not the end product. Their end product is a system that includes peripherals and software.
In today’s landscape, both semiconductor and system companies are racing to make announcements about their own custom accelerators in a vibrant and growing market segment. A custom accelerator is an ASIC, or a chip dedicated to a specific function. It is not a generic CPU or GPU. Nor is it an application serving a broad market. Instead, it is a well-defined, custom-designed accelerator for a specific AI or machine learning (ML) function.
A company uses AI and ML to design its chips and they are not designed by hardware engineers. Because everything starts with a software driver, software defines the product. This new type of user is not taking the derivative of a whole design for targeted chips to address a specific market or application. In this design flow, hardware design is started only after the system specification is defined.
The number of companies making AI or ML chips are generating requirements for loads of verification of big systems because these chips are large and need to run massive workloads and software. The growth is in many areas, not just one. Add hyperscalers as another category not relying on traditional semiconductor companies. All are making their own chips where the size of the workload they run are perfect fits for an emulation and prototyping platform.
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Thursday, May 30th, 2024
In an industry accustomed to incremental change, Veloce CS is a departure because it is a complete three-in-one system, a development that Ron Wilson, a longtime technology editor, explores with Brunet in this 2 part blog.
Wilson: What is Siemens’ value proposition?
Brunet: Low cost of purchase and operation, seamless fit into the datacenter and shareability define the value proposition for the Veloce Strato CS and Veloce Primo CS systems at the enterprise level. Also, high performance and fast model compiles, scalability to 44-billion gates and congruence—commonality of RTL models, operation, and databases for the two systems extended to include the at-speed proFPGA CS system.
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Tags: Hardware Assisted Verification, Veloce No Comments »
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