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Archive for the ‘Chip Design’ Category

The value of a shift left strategy in IC design

Friday, September 1st, 2023

By David Abercrombie and Michael White

No matter what process node you’re working at, or how big or how complex your integrated circuit (IC) design is, design enablement is a complex process that goes through multiple stages. The faster you get your design to market, the better your chances of achieving your market goals. But getting your design to the foundry on schedule, while ensuring the final product will not only be manufacturable, but also provide the intended performance and reliability, all depends on achieving and maintaining high productivity and quality of results throughout the design flow.

 

IC design companies, like any other business, constantly look for ways to improve and speed up their processes. One approach that has recently gained significant traction is the idea of “shifting left”—performing design layout verification and optimization earlier in the design flow, instead of waiting until the signoff verification stage. However, simply shifting signoff physical verification to earlier stages of the design flow is neither practical nor productive. Signoff verification is intended to apply to full chip designs where all components are complete and connected. Running signoff verification on incomplete or “dirty” designs is not only time-consuming, but also returns millions of errors, many of which are irrelevant, as they are caused by the incomplete nature of the layout. Hardly the increase in productivity the design companies were hoping for.

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IBM Research’s latest analog AI chip for deep learning inference

Tuesday, August 22nd, 2023

By: Abu Sebastian, Manuel Le Gallo-Bourdeau, Vijay Narayanan

The energy-efficient chip showcases critical building blocks of a scalable mixed-signal architecture.

A rendering of IBM’s analog AI chip.

We’re just at the beginning of an AI revolution that will redefine how we live and work. In particular, deep neural networks (DNNs) have revolutionized the field of AI and are increasingly gaining prominence with the advent of foundation models and generative AI. But running these models on traditional digital computing architectures limits their achievable performance and energy efficiency. There has been progress in developing hardware specifically for AI inference, but many of these architectures physically split the memory and processing units. This means the AI models are typically stored in a discrete memory location, and computational tasks require constantly shuffling data between the memory and processing units. This process slows down computation and limits the maximum achievable energy efficiency.
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IDEAS Online Technical Conference Features Intel, Qualcomm, Nvidia, IBM, Samsung, Dishing on Their Chip Design Experiences

Thursday, December 1st, 2022

Ansys is hosting IDEAS Digital Forum 2022, a premier virtual event bringing together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics.

See the full online conference agenda and list of speakers here. No cost registration allows you to attend the event on December 6th or on-demand at your convenience.

IDEAS kicks off with Keynote addresses from Intel’s Raja Koduri, Qualcomm’s Pankaj Kukkal, and surprising insights into the metaverse from DP Prakash with start-up Youtopian.

Keynote Speakers and Panelists at IDEAS on December 6th, 2022

You can also attend the IDEAS Panel Discussion in the afternoon entitled “Thermal Management: How to Keep Your Cool When Chips Get Hot. The Ed Sperling moderated panel discussion features Jean-Philippe Fricker from Cerebras, Roopashree HM from Texas Instruments, and Bill Mullen, senior director of R&D at Ansys.

8 technical tracks follow the Keynotes spanning Thermal Integrity, Power Integrity, Timing Closure, Electromagnetics, Machine Learning, Hardware Security, and Photonics. Over 30 technical presentations by real design engineers address case studies of their semiconductor, electronic, and optical designs from companies including:

Intel
Samsung
GUC
Qualcomm
MediaTek
HP Enterprise
Nvidia
IBM
NXP

Select authors will be available for Q&A chat with the event attendees after their presentations – don’t miss this opportunity to interact with industry experts.

To see the full agenda, Register now for IDEAS to add this premier event to your calendar.

Register now




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