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Intel Advances Hardware, Cloud and Connectivity at Open Compute Project Global Summit

Thursday, March 14th, 2019

What’s New: At the Open Compute Project (OCP) Global Summit, Intel today announced new open hardware advancements enabling greater computing capabilities, innovation and cost efficiencies for data center hardware developers. The new advancements include a high-density, cloud-optimized reference design; collaboration with Facebook on the upcoming Intel Cooper Lake processor family; and optimization on Intel’s Rack Scale Design.

 Jason Waxman, Intel corporate vice president

Jason Waxman, Intel corporate vice president in the Data Center Group and general manager of the Datacenter Solutions Group, speaks Thursday, March 14, 2019, during a keynote address at the Open Compute Project Global Summit in San Jose, Calif. (Credit: Jurgen Project Productions)

“OCP is a vital organization that brings together a fast-growing community of innovators who are delivering greater choice, customization and flexibility to IT hardware. As a founding member of this open source community, Intel is committed to delivering innovative products that help deploy infrastructure underlying the services that support the digital economy.”
–Jason Waxman, Intel corporate vice president, general manager and data-centric chief strategy officer

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