The Dominion of Design
Sanjay Gangal is a veteran of Electronics Design industry with over 25 years experience. He has previously worked at Mentor Graphics, Meta Software and Sun Microsystems. He has been contributing to EDACafe since 1999.
December 20th, 2012 by Sanjay Gangal
ARM (LSE: ARM) (NASDAQ: ARMH) and Cadence Design Systems, Inc. (NASDAQ: CDNS) announced the tape-out of the first 14-nanometer test chip implementation of the high-performance ARM® Cortex™-A7 processor, the most energy-efficient applications processor from ARM. Designed with a complete Cadence® RTL-to-signoff flow, the chip is the first to target Samsung’s 14-nanometer FinFET process, accelerating the continuing move to high-density, high-performance and ultra-low power SoCs for future smartphones, tablets and all other advanced mobile devices.
November 5th, 2012 by Sanjay Gangal
Article source: Kilopass Technology
“Kilopass Roadmap for Advanced TSMC Processes” by Harry Luan, chief technology officer at Kilopass Technology Inc., was presented at the 2012 TSMC Open Innovation Platform Ecosystem Conference on Tuesday, October 16, at 4:30 p.m. in the San Jose Convention Center, San Jose, California. Kilopass is a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP).
“Novel New Vertically-Oriented, Antifuse Non-Volatile Memory Bit Cell” by Harry Luan, CTO of Kilopass Technology
October 22nd, 2012 by Sanjay Gangal
Article source: Kilopass Technology
Harry Luan, chief technology officer at Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP) presenting “Novel New Vertically-Oriented, Antifuse Non-Volatile Memory Bit Cell” at MemCon 2012 on Tuesday, September 18, at 2:15 p.m. at the Santa Clara Convention Center, Santa Clara, Calif.
The new embedded VCM (Vertical Cross-point Memory) NVM IP bit cell quadruples the density of today’s anti-fuse NVM IP bit cell. The VCM bit cell will make possible program storage where today’s embedded non-volatile memory (eNVM) technology is cost-prohibitive or unavailable at capacities of 4Mb to 32Mb. It will also enable a higher level of performance more similar to SRAM compared to existing slower eNVM technologies or external flash or EEPROM chips.
October 11th, 2012 by Sanjay Gangal
Author: David Chandler, MIT News Office
MIT team applies technology developed for visual ‘cloaking’ to enable more efficient transfer of electrons.
A new approach that allows objects to become “invisible” has now been applied to an entirely different area: letting particles “hide” from passing electrons, which could lead to more efficient thermoelectric devices and new kinds of electronics.
The concept — developed by MIT graduate student Bolin Liao, former postdoc Mona Zebarjadi (now an assistant professor at Rutgers University), research scientist Keivan Esfarjani, and mechanical engineering professor Gang Chen — is described in a paper in the journal Physical Review Letters.
Normally, electrons travel through a material in a way that is similar to the motion of electromagnetic waves, including light; their behavior can be described by wave equations. That led the MIT researchers to the idea of harnessing the cloaking mechanisms developed to shield objects from view — but applying it to the movement of electrons, which is key to electronic and thermoelectric devices.
September 24th, 2012 by Graham Bell
I was speaking with experts at Mentor about the latest developments in back-end physical verification (PV) and design-for-manufacturing (DFM). It prompted me to take a look at what has changed and what will be essential going forward. Here is what I see for this critical area for IC implementation.
First, we have passed the 28nm barrier and are already looking to a new generation of design. Leading-edge design starts are now at 20nm and we will see production silicon for that node by early 2013. However, in a new research brief, “Driving first-time silicon success across the IC ecosystem,” by Dr. Handel Jones, semiconductor analyst at IBS, the total number of design starts is not growing. While System integrators such as Samsung and Apple, are furiously growing their mobile businesses, the ability to integrate ever-larger collections of IP in their SOCs means they do not need to include more ICs in their phones to expand the features of their products. It is also true that 20nm designs have a much higher NRE than previous generations. Naturally, this economic incentive will keep some design starts at the 28nm and larger nodes.
July 31st, 2012 by Sanjay Gangal
Article source: ASQED
ASQED 2012 was held on July 10-11 at Penang, Malaysia.
The 4th Asia Symposium on Quality Electronic Design (ASQED 2012) was the fourth event organized by the International Society for Quality Electronic Design with technical sponsorship from several IEEE Societies. This event was sponsored and managed by SHRDC. ASQED emphasizes innovations and the latest developments in System and IC Design, MEMS & NEMS, Semiconductor Technology & Manufacturing, IC Packaging & PCB Technology, Test, and Bio & Nano Electronics.
June 28th, 2012 by Shachi Nandan Kakkar
Before I step on stage for a performance, I look at the crowd and say, “Lord, please don’t let me screw this up.” But it is the effort before this performance that really leads to this moment. First we have a casting process, where we try to find the best actor to play the lead, then the understudy, then the extras and technical team etc. This is usually done by a director, someone who has excelled at acting before, and develops the entire vision. Then we memorize our lines, this is the most mind-numbing and difficult part, so to prevent mental break downs, we divide the script up into smaller parts. We start with a few simple lines, then progressively add more lines and difficulty of memorization. Then we block the entire play, see what goes where, and perform it. Next, we have dress rehearsals, we get comfortable performing in our costumes and make sure things go off without a hitch. Now after all of this, we present it to the audience and hope that we don’t get pelted with tomatoes. After we perform, we wait for the audience to react, if they respond with cheers, we repeat the act the same way the next night with minor adjustments, if we are hurt and killed with articles of food, we then see what to improve and make changes for the next show.
May 23rd, 2012 by Rob van Blommestein
The DAC frenzy has begun. We at Jasper are excited to be going to DAC and showing the industry the latest in our leading Jasper formal technology.
We recently introduced our JasperGold Apps that help customers achieve substantial productivity gains in design and verification through individual Apps within a shared interactive environment that fit into existing verification flows. The JasperGold Apps helps solve engineers’ toughest problems, addressing an array of design and verification functionality issues throughout the flow, such as:
You can see the JasperGold Apps in action in our booth.
May 10th, 2012 by Susan Smith
It seems that HP has invested in its hardware division big time with several unveilings this week, including notebook PCs, the HP Photosmart 5520 e-All-in-One printer, Ultrabook and Sleekbook offerings as well as for businesses, the HP t410 All-in-One (AiO) Smart Zero Client.
HP Pavilion notebook PCs include enhanced features and reflect the company’s new HP Mosaic design approach.
April 27th, 2012 by Graham Bell
Calypto has just published a new report on trends in the area of low power design, based on an independent, global RTL power analysis and optimization survey. The survey was executed in late 2011 and had 744 SoC, IC, and FPGA design professionals respond; this report will analyze the survey results and identify relevant year-to-year trends.
By analyzing this comprehensive feedback from design engineers and engineering management, we can better understand the effort spent on reducing power consumption in the design cycle, as well as the popular low power techniques being applied. This becomes especially critical with scaling technology nodes to 65 nm and beyond.
The topics covered in this report are: