Archive for March, 2019
Thursday, March 14th, 2019
What’s New: At the Open Compute Project (OCP) Global Summit, Intel today announced new open hardware advancements enabling greater computing capabilities, innovation and cost efficiencies for data center hardware developers. The new advancements include a high-density, cloud-optimized reference design; collaboration with Facebook on the upcoming Intel Cooper Lake processor family; and optimization on Intel’s Rack Scale Design.
Jason Waxman, Intel corporate vice president in the Data Center Group and general manager of the Datacenter Solutions Group, speaks Thursday, March 14, 2019, during a keynote address at the Open Compute Project Global Summit in San Jose, Calif. (Credit: Jurgen Project Productions)
“OCP is a vital organization that brings together a fast-growing community of innovators who are delivering greater choice, customization and flexibility to IT hardware. As a founding member of this open source community, Intel is committed to delivering innovative products that help deploy infrastructure underlying the services that support the digital economy.”
–Jason Waxman, Intel corporate vice president, general manager and data-centric chief strategy officer
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Tags: AI, Coopler lake, Intel Xeon, OCP Global Summit, Scalable Processors No Comments »
Wednesday, March 13th, 2019
What’s New:A computer science research group from the Hebrew University of Jerusalem has mathematically proven that artificial intelligence (AI) can help us understand quantum physics phenomena. The results have been published in Physical Review Letters. Intel Senior Vice President and Mobileye CEO Prof. Amnon Shashua shared the group’s findings during a keynote Wednesday at the Science of Deep Learning Conference hosted by The National Academy of Sciences in Washington, D.C.
Intel Senior Vice President and Mobileye CEO Prof. Amnon Shashua speaks Wednesday, March 13, 2019, at the Science of Deep Learning Conference hosted by The National Academy of Sciences in Washington, D.C. A computer science research group led by Shashua from the Hebrew University of Jerusalem has mathematically proven that artificial intelligence can help us understand quantum physics phenomena. (Credit: Intel Corporation)
“Our research proves that the AI algorithms can represent highly complex quantum systems significantly more efficiently than existing approaches.”
–Prof. Amnon Shashua, Intel senior vice president and Mobileye president and CEO
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Tags: Deep learning, quantum physics No Comments »
Thursday, March 7th, 2019
Deploying vision capabilities on edge platforms requires difficult tradeoffs between latency, throughput, memory footprint, communication bandwidth, power, and cost. Luckily, there’s an ever-growing diversity of hardware choices to allow system designers to select the best option that meets their needs. Historically, hardware diversity also implied time-consuming software development to port vision applications and algorithms to a new hardware target and optimize for real-time constraints. Intel® is working with the industry to solve the puzzle of hardware diversity for traditional and deep learning-based vision at the edge.
The Intel® Distribution of OpenVINO™ toolkit (which stands for Open Visual Inference and Neural Network Optimization) enables developers to streamline the deployment of deep learning inference and high-performance computer vision applications across a wide range of vertical uses cases at the edge. The toolkit is compatible with popular open source deep learning frameworks, and enables developers to easily target execution on CPUs and accelerators (GPUs, FPGAs, VPUs, and so on) specially designed for AI inference, such as Intel® Vision Accelerator Design Products. The beauty of the toolkit is that it provides a unified and common abstraction layer for AI inference across diverse hardware targets, with a comprehensive and intuitive API that merges simplicity with optimized performance. Software simplicity and performance – just what the developer ordered!
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Monday, March 4th, 2019
In March 2019, Intel Corporation announced that it has contributed the Thunderbolt protocol specification to the USB Promoter Group. The USB Promoter Group also announced the pending release of the USB4 specification, based on the Thunderbolt protocol. The convergence of the underlying Thunderbolt and USB protocols will increase compatibility among USB Type-C connector-based products, simplifying how people connect their devices. (Credit: Tim Herman/Intel Corporation)
What’s New: Intel is well on its way to making the innovation delivered with Thunderbolt™ 3 available to everyone. Today, Intel announced that it contributed the Thunderbolt protocol specification to the USB Promoter Group, enabling other chipmakers to build Thunderbolt-compatible silicon, royalty-free. In addition, the USB Promoter Group announced the pending release of the USB4 specification, based on the Thunderbolt protocol. The convergence of the underlying Thunderbolt and USB protocols will increase compatibility among USB Type-C connector-based products, simplifying how people connect their devices.
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