Catching up on some of the August news after the summer break, let’s start by briefly recalling Intel’s disappointing second-quarter results and the company’s cost-reduction plan: Intel will cut its headcount by more than 15%, with the majority completed by the end of 2024. Consistently with the cost-reduction plan, Intel has reportedly sold its share stake in Arm. More news this week include new solutions challenging Nvidia AI dominance, just when Nvidia’s Blackwell family is experiencing issues in reaching high volume production. According to SemiAnalysis, the problems are related to the complexity of TSMC’s CoWoS-L packaging technology and insufficient capacity for this specific version of the package.

TSMC’s European joint venture holds groundbreaking ceremony

On August 20, ESMC – a joint venture between TSMC, Bosch, Infineon and NXP – held a groundbreaking ceremony for its first semiconductor fab in Dresden, Germany. When fully operational, ESMC is expected to have a monthly production capacity of 40,000 300mm wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology. Total investments are expected to exceed 10 billion euros consisting of equity injection, debt borrowing, and strong support from the European Union and German government.

Fraunhofer’s Chiplet Center of Excellence

Also based in Dresden, Germany, is the Chiplet Center of Excellence (CCoE) launched by three Fraunhofer Institutes with the purpose of partnering with industry to drive forward the introduction of chiplet technology. The CCoE will initially focus on automotive applications, developing the first workflows and methods for electronics design, demonstrator construction, and the evaluation of reliability. The Fraunhofer initiative adds to the already existing “Automotive chiplet program” from Belgian technology hub imec.

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Scarce supply isn’t the only issue worrying hyperscalers when it comes to relying on Nvidia GPUs: the other factor is high price. The quest for a cheaper, homegrown alternative is driving Amazon’s chip development effort, according to a Reuters report. And Nvidia’s dominant position in the AI market prompted U.S. progressive groups and Democratic Senator Elizabeth Warren to press the Department of Justice to investigate the GPU leader over competition concerns. Meanwhile, Cerebras – an Nvidia competitor – has reportedly filed for an initial public offering in the United States, in a confidential manner.

Ultra Librarian-Footprintku AI partnership

Ultra Librarian has announced a partnership with Footprintku AI aimed at bringing Footprintku AI’s technologies in Design-for-Manufacturing (DFM) processes into the Ultra Librarian CAD library. Goal of this collaboration is to provide a new on-demand DFM-aware library for companies looking to enhance and validate their libraries for DFM.

New fab updates: Amkor, SK hynix

Packaging service provider Amkor has signed a non-binding preliminary memorandum of terms with the US Department of Commerce to receive proposed funding as part of the CHIPS and Science Act. Amkor announced in November 2023 its plans to build its first domestic OSAT (outsourced semiconductor assembly and test) facility in Peoria, Arizona. The company projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility. Upon completion, this will be the largest outsourced advanced packaging and test facility in the United States. The terms include up to $400 million in proposed direct funding, and access to $200 million in proposed loans.

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