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Archive for June 4th, 2024

New chiplet description standard; AMD’s AI acceleration roadmap; Ultra Accelerator Link; 3-layer CMOS image sensors

Tuesday, June 4th, 2024

Some of this weeks’ news updates are coming from Computex, Taiwan’s computer expo, which this year offered speeches from a lineup of semiconductor CEOs including AMD’s Lisa Su, Nvidia’s Jensen Huang, Intel’s Pat Gelsinger, Arm’s Rene Haas, and Qualcomm’s Cristiano Amon. While Computex isn’t the only thriving show in the IT world – just think of CES or MWC – it’s interesting to notice that its American and European counterparts died years ago. Las Vegas’ Comdex was held only until 2003; Hanover’s CeBit survived until 2018.

Ansys simplifies cloud-based simulation on Azure

Ansys has launched “Ansys Access on Microsoft Azure” to enable seamless deployment of pre-configured Ansys products on Azure cloud platform infrastructure. According to the company, Ansys’ customers using their own Azure subscription with existing Ansys licenses can now benefit from a more scalable, secure, and cost-effective approach to running HPC simulations in the cloud.

As Ansys explained in a press release, there are many challenges that need to be addressed when using simulation in the cloud. These include validating on-premises workloads that have been shifted to the cloud, the ongoing work to deploy and test new virtual machines and configuring adjacent cloud-based infrastructure in a cost-effective manner. “Ansys Access on Azure” addresses these challenges by delivering pre-tested and configured Ansys applications updated with each major release and aligned to a curated set of recommended VMs and HPC infrastructure. According to Ansys, this simplifies implementation for IT departments, giving them better control over cost.

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