Is pain a positive thing for character-building? Or is it just that humans instinctively need to find a reason to justify pain? Quite an off-topic question here – but not that much, after all, if it stems from a speech given by Nvidia CEO Jensen Huang. For his take on character-building, see the “Further reading” paragraph at the end of this week’s news roundup. But first, some on-topic technology updates.
New Synopsys announcements from SNUG Silicon Valley
Here’s a quick overview of some of the announcements Synopsys made on occasion of its recently held annual Synopsys User Group (SNUG) conference in Silicon Valley. In the area of multi-die designs, 3DSO.ai is a new AI-driven capability built natively into Synopsys 3DIC Compiler, a unified exploration-to-signoff platform. 3DSO.ai offers optimization for signal integrity, thermal integrity, and power-network design. Also targeted at multi-die designs, Synopsys Platform Architect – Multi-Die accelerates design timelines, delivering – according to the company – a six to twelve month “shift left” from RTL for the analysis of performance and power, while accounting for the interdependencies between multiple dies and allowing early partitioning decisions. Synopsys also unveiled two new hardware-assisted verification solutions: ZeBu EP2, the latest version in the ZeBu EP family of unified emulation and prototyping systems; and HAPS-100 12, Synopsys’ highest capacity and density FPGA-based prototyping system. Additionally, the company introduced Synopsys Cloud Hybrid solution, which enables users to burst from on-prem data centers to the cloud during peak needs – automatically splitting the job based on available capacity and eliminating manual data transfers. Lastly, Synopsys announced that it has completed the acquisition of Netherland-headquartered Intrinsic ID, a provider of Physical Unclonable Function (PUF) IP.
Altair to extend its meshless technology to electronics
Altair has announced the upcoming release of Altair SimSolid for electronics – promising fast, easy, and precise multi-physics scenario exploration for electronics, from chips to PCBs and full system design. SimSolid is an already existing Altair product, which so far has gained adoption in industries such as aerospace and automotive. According to the company, SimSolid’s main benefit is its ability to eliminate geometry simplification and meshing, the two most time-consuming and expertise-intensive tasks done in traditional finite element analysis. As a result, it is up to 25x faster than traditional finite element solvers, and effortlessly handles complex assemblies. Extending Altair SimSolid’s meshless technology to electronics will enable the tool to tackle intricate challenges like signal integrity, power integrity, and electromagnetic compatibility/interference, all while making simulations more accessible and efficient.
