Cadence’s Multiphysics Platform; Arm’s record numbers; stretching the capabilities of standard packaging

Going public has proven to be a good choice for Arm so far. As reported by Reuters, Arm’s share price increased by more than 30% on February 7 on the strong forecast the company announced on occasion of its last quarter results. Arm’s shares are now reportedly traded at twice the price of the initial public offering. Arm’s results are part of this week’s news roundup; but first, some EDA updates.

EDA updates: Cadence, Ansys, SignatureIP, Accellera

Challenging multiphysics incumbents such as Ansys, Cadence has announced its Millennium Enterprise Multiphysics Platform, what it claims is the industry’s first hardware/software accelerated digital twin solution for multiphysics system design and analysis. The first-generation Millennium M1 accelerates high-fidelity computational fluid dynamics (CFD) simulations, mostly targeting the simulation of complex mechanical systems. Available in the cloud or on premises, this solution includes GPUs from “leading providers”, and a Cadence Fidelity CFD software stack optimized for GPU acceleration and generative AI. Millennium M1 instances can be fused into a unified cluster, enabling near-linear scalability.

The latest release from Ansys, 2024 R1, includes a new user interface and a number of other improvements. As for electronics applications, Ansys claims that this release offers significant advances in simulation performance, meshing, and automated workflows. It covers various applications such as combined chip-package-PCB simulation, RF, HPC, 3D IC, and electric motors. New capabilities include ECAD-MCAD integration in Ansys Maxwell for flex and rigid PCBs, adaptive templates in Ansys Motor-CAD, and multi-solver interoperability for multiphysics and multiscale solutions.

SignatureIP has launched its new iNoCulator network-on-chip configuration tool with a free trial period. According to the company, the iNoCulator tool enables engineers to quickly experiment with different configurations of the SoC architecture and then simulate them in real time to measure throughput and latency so that they can optimize the design at the top level. Thus, the system architect sets the design targets (power, performance, area and timings) into iNoCulator, and the tool creates possible topologies that can be tweaked to find the optimal solution.

Accellera has formed the SystemVerilog Mixed-Signal Interface Types Working Group, with the scope of documenting a SystemVerilog-compatible language extension to permit interconnect, conversion, and resolution among dissimilar net types in SystemVerilog – including bidirectional connections. Accellera’s goal is to release this new extension as an addendum to IEEE standard 1800-2023. According to Accellera, there is a fundamental need for support of bidirectional net connections between logic/UDN (User-Defined Nets) and analog/electrical/real signals as an integral part of IEEE 1800. Past efforts to add similar functionality outside of IEEE 1800, such as Verilog-AMS connect modules, have proven unable to address the complexity and usability requirements that have arisen in typical System-on-Chip designs. Over time various limitations have had to be addressed by EDA vendors. The SystemVerilog MSI Working Group is tasked with resolving these issues.

Chiplet interconnect at 64Gbps/bump with standard packaging

Eliyan has announced the successful tape out of its PHY solution for multi-die architectures, called NuLink, achieving bandwidth of 64Gbps/bump on a 3-nanometer process using standard packaging. According to the company, NuLink enables die-to-die connectivity on organic substrates at unprecedented power, area, and latency, eliminating the need for complex silicon interposers in most applications. NuLink is compatible with emerging interconnect standards such as UCIe, BoW, and UMI (Universal Memory Interconnect, for die-to-memory applications).

More packaging updates

Raytheon has been awarded a $20 million contract from the US Department of Defense to develop a next-generation multi-chip package for use in ground, maritime and airborne sensors.

SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) are offering a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States.

Illinois-headquartered NHanced Semiconductors has recently opened an advanced semiconductor packaging facility in Odon, Indiana, some 90 miles south-west of Indianapolis.

Arm’s record results

Arm has posted record results for the quarter ending December 31, 2023. Revenues were $824 million, up 14% year-over-year. Royalty revenue was $470 million, up 11% year-over-year. License revenue was $354 million, up 18% year-over-year. Non-GAAP operating profit increased 17% year-over-year to $338 million resulting in a 41.0% non-GAAP operating margin. As the company stated in a letter to shareholders, Arm’s highest-ever royalty revenue was driven by multiple factors. Firstly, Arm continues to benefit from higher royalty rates as the adoption of Armv9 technology increases. The royalty rates for Armv9 products are typically at least double the royalty rates for equivalent Armv8 products. Secondly, Arm continues to gain market share in the cloud servers and automotive markets. Lastly, the semiconductor market is showing signs of recovery, particularly in smartphones. Arm’s licensing revenue was supported by increasing demand for new technology driven by AI. In general, the company is benefitting from the increasing diversification of its target markets, with the growth of other segments besides mobile.

Source: Arm

Second TSMC fab in Japan

TSMC and its Japanese minority partners in JASM (Japan Advanced Semiconductor Manufacturing) will build a second JASM fab in Kumamoto Prefecture, Japan. The new facility is scheduled to begin operation by the end of the 2027. Together with JASM’s first fab, which is scheduled to begin operation in 2024, the overall investment in JASM will exceed US$20 billion with strong support from the Japanese government. With this addition, JASM’s Kumamoto site is expected to offer a total production capacity of more than 100,000 12-inch wafers per month starting from 40, 22/28, 12/16 and 6/7 nanometer process technologies.

Chinese carmaker Geely expanding its satellite network

China-headquartered Geespace – the satellite company belonging to the same group as Chinese carmaker Geely – has recently completed its second successful satellite launch from China’s Xichang Satellite Launch Center. The eleven new low-earth-orbit satellites are part of “Geely Future Mobility Constellation” satellite network. By 2025, Geespace aims to establish satellite-based global real-time data communication services following the full deployment of 72 satellites. The second phase of the plan will expand the network to 168 satellites, delivering global centimeter-level positioning services. Geespace capabilities include satellite development, production, TT&C (telemetry, tracking, and command) and application. Car models among Geely portfolio brands currently equipped with satellite communication functionality include the new Zeekr 001 FR, Zeekr 007 and Geely Galaxy E8.

Acquisitions

Neuromorphic processing company SynSense (formerly aiCTX) will acquire iniVation, a neuromorphic vision sensing provider. The existing iniVation entity based in Zurich, Switzerland, will continue to operate. SynSense’s products are based on technologies originated from University of Zurich and ETH Zürich.

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