Confirming the growing importance of thermal aspects in electronic design, this week’s news roundup opens with two EDA announcements in this area. South Korea is also in the news with Samsung’s 3-nanometer updates and the country’s “mega cluster” plan.
Thermal design solutions from Cadence and Siemens EDA
Cadence has announced Celsius Studio, what it claims is the industry’s first complete AI thermal design and analysis solution for electronic systems. Celsius Studio addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies. According to Cadence, current product offerings in the area of thermal design consist mostly of disparate point tools, whereas Celsius Studio is a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyze and optimize product performance without the need for geometry simplification, manipulation and/or translation. Celsius Studio aims at system-level thermal integrity, converging electro-thermal co-simulation, electronics cooling and thermal stress. It was made possible by Cadence’s acquisition of Future Facilities in 2022.
Siemens EDA’s latest updates to Simcenter Flotherm software for electronics cooling simulation includes the “Embeddable Boundary Condition Independent Reduced Order Model” (BCI-ROM) technology, which allows a semiconductor company to generate an accurate model that can be shared with their clients for use in downstream high-fidelity 3D thermal analysis without exposing the IC’s internal physical structure. Siemens EDA introduced BCI-ROM in this October 2023 article.
