Updates concerning automotive applications make up a significant part of this week’s news roundup. Among the other themes, backside power delivery is getting closer to real-life applications; and more subsidies are going to benefit the European semiconductor ecosystem.
More European subsidies
In addition to the EU Chips Act, the European Union and some individual member States are going to provide more subsidies to their domestic semiconductor ecosystem. The European Commission has approved an “Important Project of Common European Interest” (‘IPCEI’) to support research, innovation and the first industrial deployment of microelectronics and communication technologies across the value chain. Fourteen member States will provide up to €8.1 billion in public funding, which is expected to unlock additional €13.7 billion in private investments. As part of this IPCEI, 56 companies, including small and medium-sized enterprises and start-ups, will undertake 68 projects.
Source: European Commission
Separately, the French government has announced it will provide 2.9 billion euros ($3.10 billion) in state aid to help support an investment of 7.5 billion euros that STMicroelectronics and GlobalFoundries are making to build a semiconductor factory in Crolles, France.
