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Archive for April 28th, 2023

AI-based PCB design; SerDes and UCIe advancements; fully configurable Risc-V cores; Arm’s own silicon chip

Friday, April 28th, 2023

Catching up on some of the news from the past few weeks, let’s start by noting that yet another hyperscaler is developing its own AI chip: according to press reports, Microsoft is working on a device code-named Athena, currently being tested. Microsoft is reportedly accelerating the rollout following the success of ChatGPT.

Cadence leverages AI and the cloud to speed up PCB design

The new Cadence Allegro X AI technology promises to reduce the time for PCB placement and routing tasks from days to minutes, and with equivalent or higher quality compared with manually designed boards. Reduction in design turnaround time is achieved by automating placement, metal pouring and critical net routing – leveraging a scalable architecture that uses compute infrastructure on the cloud. Placement automation using generative AI enables feasibility analysis in the early phases of design. Exploring a much larger solution space than what is possible through manual methods, the technology drives optimization of metrics such as shorter wire lengths while adhering to the design constraints. Integration with signal integrity and power integrity analysis through the Allegro X Platform enables the user to optimize the designs for electrical and thermal performance. According to Cadence, the solution achieves a 10X or more reduction in PCB design turnaround time.

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