Open side-bar Menu
 EDACafe Editorial

Archive for January, 2023

EDA Q3 2022 numbers; new PCB SI tools; chiplet description standard; FPGA applications; WiFi-based imaging

Thursday, January 26th, 2023

Tech giants have been in the news over the past few days for a wave of workforce reductions: the list includes Alphabet (Google), Amazon, Microsoft, Meta (Facebook), and IBM. In at least two cases, these cost-cutting moves are accompanied by new investments in artificial intelligence: Alphabet reportedly plans to double down on AI, and Microsoft has just announced the third phase of its long-term partnership with OpenAI through a multiyear, multibillion dollar investment. Let’s now move to this week’s news roundup, starting with some EDA updates.

EDA industry Q3 2022 numbers

According to the latest report from the ESD Alliance, the Electronic System Design industry revenue increased 8.9% from $3,458.2 million in Q3 2021 to $3,767.4 million in Q3 2022. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.4%. Exceptions to these good results are the Semiconductor Intellectual Property (SIP) product category, with a 1% revenue decrease, and the Japan region with an 8.5% revenue decline. The EMEA region (Europe, Middle East, and Africa) reported just a 0.2% increase in Q3 2022.

New PCB signal integrity tools from Keysight and Avishtech

Keysight has introduced the Electrical Performance Scan (EP-Scan), a new high-speed digital simulation tool that supports rapid signal integrity analysis for hardware engineers and printed circuit board designers. According to the company, uncertainty about the length of the SI analysis phase performed by SI specialists creates a bottleneck in the PCB design cycle and delays time-to-market. EP-Scan addresses SI analysis bottlenecks by giving hardware designers diagnostic tools to correct designs earlier and meet development schedules.

Avishtech has launched two new low-cost toolsets, Gauss SI and SI Pro, to rapidly construct PCB stackups and simulate for impedance and loss. According to the company, up until now these capabilities were only available to large corporations, who could afford very expensive software, whereas Gauss SI and SI Pro enable every board designer and engineer to specify their stackup and design for impedance and signal integrity.

(more…)

2022 Year in Review

Sunday, January 22nd, 2023

Let’s start the new year with a quick recap of some of 2022 events and trends. A year marked by three significant anniversaries – the transistor, the microprocessor and AlexNet turning 75, 50, and 10, respectively – 2022 was also characterized by a dramatic and unexpected change of the global geopolitical and economic climate. War in Ukraine, the spike in energy prices, and inflation shaped a new scenario.

From chip shortage to capex drop

At the beginning of 2022 “the” problem was the chip shortage forcing several carmakers to halt their assembly lines, with governments asking foundries to increase capacity. Just a few months later, several chipmakers cut their planned capital expenditure citing weaker consumer demand. Among them Taiwanese foundry UMC, and South Korean memory maker SK hynix, which decided to cut its investment next year by more than 50% due to the deterioration of the memory market conditions. Market research firm IC Insights forecasts a -19% drop in total worldwide semiconductor capital industry spending in 2023.

An unprecedented amount of subsidies

In 2022, the escalation in geopolitical tensions – especially between the U.S. and China – prompted governments around the world to subsidize their domestic semiconductor industry, with the goal of gaining independence. An unprecedented amount of taxpayers’ money is set to benefit qualified applicants over the next few years: $52.7 billion in the U.S. (CHIPS and Science Act), $45 billion in the European Union (EU Chips Act), $10 billion in India. Adding to this, the Japanese government will subsidize the newly established Rapidus chipmaker company. On the other side of the barricade, China is reportedly working on a $143 billion support package for its semiconductor industry. As for the U.S., 2022 saw the birth of two initiatives related to geopolitical tensions (America’s Frontier Fund) and to subsidies (American Semiconductor Innovation Coalition).

(more…)

CDC standard; PDF-proteanTecs collaboration; TSMC 3nm ceremony; new chips for Apple and Dell

Thursday, January 19th, 2023

Catching up on some of the latest news after seasonal holidays – but skipping the CES announcements overload – let’s start by briefly mentioning the recent Risc-V Summit where a Google executive spoke about Google’s support for the porting of Android to Risc-V: here’s the video of the speech.

Accellera to develop a Clock Domain Crossing standard

Accellera has announced the formation of the Clock Domain Crossing (CDC) Working Group, with the goal of defining a standard CDC collateral specification to ease SoC integration. Currently, lack of standard means that different CDC verification tools generate incompatible IP-level CDC collateral. This scenario is causing a CDC verification problem when the SoC teams source IP from IP providers that use a different tool for their own CDC verification.

PDF Solutions and proteanTecs to collaborate on analytics-telemetry solutions

PDF Solutions, a provider of semiconductor data analytics, and proteanTecs, a specialist of on-chip telemetry, have announced a collaboration on combined solutions intended to provide deeper insights on semiconductor yield, quality and reliability. The collaboration includes PDF Solutions’ Exensio Analytics platform, advanced AI/ML models and DEX data exchange network, and proteanTecs’ agents with cloud/edge analytics based on ML-driven chip telemetry. According to the two companies, the combined solutions will deliver unique benefits, such as adaptive test capabilities to further improve test quality and reduce DPPM (defective parts per million), enhanced device quality grading for downstream testing, and more insights around RMAs (return material authorizations) from in-field degradation monitoring.

(more…)




© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise