As the industry celebrates the 75th anniversary of the invention of the transistor, geopolitical issues keep making news with Taiwan-headquartered TSMC stepping up its commitment to U.S. fabs. Several updates this week concern technological advancements presented at the IEDM conference.
TSMC to increase its Arizona investment
TSMC has announced that in addition to its Arizona’s first fab, which is scheduled to begin production of N4 process technology in 2024, it has also started the construction of a second fab which is scheduled to begin production of 3-nanometer process technology in 2026. The overall investment for these two fabs will be approximately US$40 billion, representing the largest foreign direct investment in Arizona history and one of the largest foreign direct investments in the history of the United States. TSMC Arizona’s two fabs are expected to directly hire 4,500 employees and, when complete, to manufacture over 600,000 wafers per year. This investment has reportedly sparked concerns in Taiwan, prompting the local government to reassure on TSMC’s commitment to the island. However, according to another report TSMC is planning to move all its 3-nanometer production to the U.S., which would enable Apple to equip its future iPhone 15 models with a new 3-nanometer processor made in the United States.
