IBM’s 2nm chip; EDA updates; AI updates; acquisitions

Catching up on some of the news from the last four weeks or so, the IBM 2-nanometer announcement definitely stands out as a major update. Several recent news also concerns EDA, as well as AI accelerators. Two of the newest updates about AI startups will translate into an additional $150 million pumped into this industry by investors.

IBM’s 2-nanometer chip

As widely reported by many media outlets, last May 6 IBM announced the development of the world’s first chip with 2-nanometer nanosheet technology. The result was achieved by IBM research lab located at the Albany Nanotech Complex in Albany, NY, where IBM scientists work in collaboration with public and private sector partners. According to the company, IBM’s new 2-nanometer chip technology will achieve 45 percent higher performance, or 75 percent lower energy use, than today’s most advanced 7-nanometer node chips. Reporting about the announcement, EETimes underlined that this chip is the first to use extreme-ultraviolet lithography (EUV) for front-end of line (FEOL) processes. Other details reported by EETimes include the use of bottom dielectric isolation to eliminates leakage current between nanosheets and the bulk wafer; and a novel multi-threshold-voltage scheme. Reportedly, IBM expects 2-nanometer foundry technology based on this work to go into production towards the end of 2024.

2 nm technology as seen using transmission electron microscopy. Courtesy of IBM.

EDA updates: Avishtech, Defacto, Keysight, SmartDV, Real Intent

Avishtech has launched its Gauss Synthesis Online Simulation and Design Service, enabling users to access Avishtech PCB stack-up and 2D field solver tools on an ‘as needed’ basis – without having to purchase a complete annual subscription or run the toolsets themselves. The online mode includes additional services such as Dimensional Stability simulations.
Defacto has introduced v9 of their EDA software offering, now called SoC Compiler – replacing the STAR product name. According to the company, Defacto tools have automated the process of building IP, SoC creation and integration for the front-end, getting RTL and design collaterals ready for logic synthesis much quicker, with more confidence and flexibility than ad-hoc approaches.
Keysight has announced PathWave Advanced Design System (ADS) 2022, a comprehensive workflow solution for DDR5, LPDDR5 and GDDR6 memory systems. According to the company, the new solution reduces design time and de-risks product development for these products.
SmartDV has unveiled a tool suite that automates the protocol debugging process and testbench creation. The automation suite includes SmartViP Debug, a tool that automatically identifies protocol violations with visual and tabular views, without requiring the user to be a protocol expert; and SmartTestBench, which automates the creation of testbench files, either through a graphical user interface or through text files.
Real Intent has expanded its range of static sign-off tools certified for use in ISO 26262 functional safety compliant flows. The range now includes Meridian RDC (Reset Domain Crossing), Meridian CDC (Clock Domain Crossing), Verix Multimode CDC, Ascent Lint (RTL & Netlist Linting), Ascent AutoFormal, Verix DFT, and iDebug (debug environment).

AI updates: AONDevices, NeuReality, Mythic, SiMa.ai

AONDevices (Irvine, CA) has announced benchmark performance and power consumption data for its AONVoice edge AI technology. In benchmarks, AONVoice processors deliver up to 90% accuracy in 0 dB SNR conditions. Including front-end processing and all required memory, AONVoice processor consumes less than 150µW in 40nm ULP silicon. AONDevices’ IP has been adopted by Dialog Semiconductor for its wireless communication ICs targeted at headsets, remote controls and other battery-powered applications.
NeuReality, an Israeli AI startup recently emerged from stealth, has unveiled the prototype of what it calls “a novel AI-centric inference platform” targeted at cloud and enterprise datacenters, carriers, telecom operators and other near edge compute solutions. Dubbed NR1-P, the platform is based on “a new type of System-on-Chip” and is built in a 4U server chassis equipped with sixteen Xilinx Versal Adaptive Compute Acceleration Platform (ACAP) cards. The next version of NR1 SoC promises “a 15X improvement in performance per dollar compared to the available GPUs and ASICs offered by deep learning accelerator vendors.”
Mythic, a developer of analog AI processors based on analog compute-in-memory technology, has announced $70 million in Series C funding led by BlackRock and Hewlett Packard Enterprise (HPE).
SiMa.ai, specializing in the AI embedded edge market, has announced an $80 million Series B financing led by Fidelity Management & Research Company.

Packaging updates: Intel, Samsung

Intel will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its 3D solution called Foveros.
Samsung has announced the immediate availability of its 2.5D packaging technology Interposer-Cube4 (I-Cube4). Samsung’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, etc.) and several High Bandwidth Memory dies on top of a silicon interposer. The new I-Cube4 incorporates four HBMs and one logic die.

Samsung’s I-Cube4 technology. Photo: Business Wire

Acquisitions

CEVA has agreed to acquire Massachusetts-based Intrinsix, a chip design specialist, for approximately $33 million in cash. Intrinsix has expertise in SoC and chiplet-based designs, and a strong presence in the aerospace & defense market.
NI has acquired monoDrive, a provider of ultra-high fidelity simulation software for ADAS and autonomous vehicle development. In conjunction with this acquisition, NI also announced a strategic collaboration with Ansys, whose solutions are used to simulate the physics of automotive sensors (radars, LiDARs, and cameras).
Qorvo has acquired NextInput (Mountain View, CA), a provider of MEMS-based force-sensing solutions for human-machine interface. NextInput sensors are used in smartphones, wearables, automobiles and other applications.
Siemens Digital Industries Software has acquired Fractal Technologies, a provider of production signoff-quality IP validation solutions, based in the U.S. and the Netherlands. Fractal’s products will join the Siemens Solido software product family.

Upcoming virtual events

The International Memory Workshop 2021 will be held from May 16 to 19.
The Embedded Vision Summit is scheduled for May 25 to 28. The event will include the “Vision Tank Start-Up Competition”, taking place on May 27.
The 2021 Optical Fiber Communication Conference and Exhibition (OFC) will run from June 6 to 11.
The Siemens EDA Verification Forum 2021 will take place from June 8 until June 29.
The 2021 Symposia on VLSI Technology & Circuits will be held from June 13 to 19.

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