EDACafe Special Report: Signal Integrity and Power Integrity Challenges in High-Speed PCB Design
Part One – Interview with Wade Smith, Application Engineer Manager at Ansys
Signal integrity and power integrity issues are becoming increasingly challenging for designers of high-speed PCBs required by next generation applications – such as 5G – and new semiconductor devices – such as DDR5 memories. What are the key aspects that designers should consider? What are the capabilities of the tools offered by EDA vendors to address these issues? To answer these questions, EDACafe has interviewed experts from some of the major vendors in this specific market. Part one of our special report features an interview with Wade Smith, application engineer manager at Ansys.
EDACafe: In your view, what are the major signal integrity and power integrity challenges posed – in high-speed PCB design – by next generation applications such as 5G and by new semiconductor devices such as DDR5 memories? Can you provide practical examples of critical issues in next-generation PCB layout?
