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Archive for June 23rd, 2022

ESD Alliance Sponsors SEMICON West Smart MedTech Pavilion Panel, Hosts Wednesday Evening Reception

Thursday, June 23rd, 2022

Just across the street from this year’s DAC is SEMICON West and, like DAC, it has a wealth of programs, including a new Sustainability Summit, a market symposium, a test vision symposium and TechTalks. A Workforce Development Pavilion will address the needs of job seekers and talent professionals.

It will also feature an ESD Alliance-sponsored panel. “Supply Chain Verification –– Critical Enabler for Next-Generation MedTech Innovations” will be held in the Smart MedTech Meet the Experts Stage at Exhibition Level, Room 2, Moscone Center South Hall.

The panel scheduled for Tuesday, July 12, from 11:35 a.m. until 12:25 p.m., will underscore system verification challenges and opportunities that impact the entire electronic product design and manufacturing supply chain. Thought leaders and experts will discuss the slowdown of Moore’s Law and the trend toward specialized packaging, tailored chips and their diverse applications, and ways in which verification across the supply chain can be improved.

Lucio Lanza, Managing Partner of Lanza techVentures, will serve as moderator. The panel will consist of experts in chip design verification including Mike Chin, Principal Software Engineer at Intel; Lu Dai, Senior Director of Engineering from Qualcomm and Chairman of Accellera; and Dave Kelf, Breker Verification Systems’ CEO. Jan Vardaman, President of TechSearch International, is an expert in manufacturing and packaging.
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