Monozukuri of Rome, Italy, one of the newest members to join the ESD Alliance, a SEMI Technology Community, is out to conquer 2.5D and 3D design challenges for next-generation electronic products by delivering innovative, groundbreaking EDA software solutions and methodologies. The company’s technology redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization.

Anna Fontanelli, Monozukuri’s founder and CEO, is an expert in deep-submicron silicon technology and design tools. She shared her perspectives on the state of Moore’s Law and challenges surrounding 2.5D integration, 3D chip stacking and advanced packaging, as well as the chip design industry’s startup environment.
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